Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Language: English
Published by Springer, 1994
- Hardcover
- Used
Hardcover
Condition: Used - Good
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- Title
- Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
- Author
- Lau, John H.
- Publisher
- Springer
- Publication year
- 1994
- Condition
- Good
- Binding
- hardcover
- Language
- English
- ISBN 10
- 0442014414
- ISBN 13
- 9780442014414
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
"Synopsis" may belong to another edition of this title.
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