Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition)

[ MEI ] BU LAN DENG&amp#183; DAI . [ MEI CAI RUN BO

Language: English

Published by Mechanical Industry Press, 2024

711175364X / 9787111753643

  • Softcover
  • New
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Language:Chinese.Paperback. Pub Date: 2024-06 Publisher: China Machine Press Testing is a method used to ensure the stability and effectiveness of integrated circuits. and is an indispensable and important means throughout all aspects of integrated circuit manufacturing. The particularity of the TSV-based 3D stacked integrated circuit structure and the variability of the design process bring new problems and challenges to the testing process. This book first discusses the basic concepts. basi.

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Title
Design for testability and test optimization technology for 3D stacked integrated circuits based on TSV(Chinese Edition)
Author
[ MEI ] BU LAN DENG&amp#183; DAI . [ MEI CAI RUN BO
Publisher
Mechanical Industry Press
Publication year
2024
Condition
New
Binding
paperback
Language
English
ISBN 10
711175364X
ISBN 13
9787111753643

liu xing

Nanjing, JS, China

5-star seller

AbeBooks seller since April 7, 2009

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