Electronic Packaging for High Reliability, Low Cost Electronics

. Ed(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko

ISBN 10: 0792352181 / ISBN 13: 9780792352181

Published by Kluwer Academic Publishers, 2000

About this Item

Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . . Books ship from the US and Ireland.

Seller Inventory # V9780792352181

Bibliographic Details

• Title: Electronic Packaging for High Reliability, Low Cost Electronics
• Publisher: Kluwer Academic Publishers
• Publication Date: 2000
• Language: English
• ISBN 10: 0792352181
• ISBN 13: 9780792352181
• Binding: Hardcover
• Condition: New

About this title

Synopsis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.