Belavic Darko (27 results)
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 190.05
US$ 16.04 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Electronic Packaging for High Reliability : Low Cost Electronics
Tummala, Rao (EDT); Kosec, Marija (EDT); Jones, W. Kinzy (EDT); Belavic, Darko (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 199.35
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 202.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Electronic Packaging for High Reliability : Low Cost Electronics
Tummala, Rao (EDT); Kosec, Marija (EDT); Jones, W. Kinzy (EDT); Belavic, Darko (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 190.03
US$ 20.08 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 164.56
US$ 79.83 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9789048150854 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbiete…r: preigu.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 239.70
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 328.
Electronic Packaging for High Reliability, Low Cost Electronics
. Ed(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 236.90
US$ 11.97 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgra…duate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . .
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 241.56
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 312.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 198.19
US$ 71.10 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, n…ew materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
Language: English
Published by Springer Netherlands, Springer Netherlands, 2000
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 198.19
US$ 72.05 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new mate…rials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 273.46
US$ 13.39 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. 296 pages. 9.25x6.10x0.70 inches. In Stock.
Electronic Packaging for High Reliability : Low Cost Electronics
Tummala, Rao (EDT); Kosec, Marija (EDT); Jones, W. Kinzy (EDT); Belavic, Darko (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 282.63
US$ 20.08 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Electronic Packaging for High Reliability, Low Cost Electronics
. Ed(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
US$ 283.49
US$ 10.50 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgra…duate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . . Books ship from the US and Ireland.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 271.61
US$ 33.46 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. Like New. book.
Electronic Packaging for High Reliability : Low Cost Electronics
Tummala, Rao (EDT); Kosec, Marija (EDT); Jones, W. Kinzy (EDT); Belavic, Darko (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 302.81
US$ 2.64 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 286.78
US$ 33.46 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 148.31
US$ 6.27 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 188.51
US$ 26.23 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new herme…tic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 308 pp. Englisch.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 159.93
US$ 55.87 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if… the devices are to remain within.
Electronic Packaging for High Reliability, Low Cost Electronics
Tummala, Rao R.|Kosec, Marija|Jones, W. Kinzy|Belavic, Darko
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 159.93
US$ 55.87 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are r…equired if the devices are to remain within.
Language: English
Published by Springer Netherlands, Springer Netherlands Feb 2000, 2000
- Hardcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
US$ 188.51
US$ 68.42 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packagi…ng, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 312 pp. Englisch.
Language: English
Published by Springer Netherlands, Springer Dez 2010, 2010
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
US$ 188.51
US$ 68.42 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic…packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 254.19
US$ 8.70 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 328.
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 254.96
US$ 8.70 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 312 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 245.07
US$ 26.23 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic pac…kaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 312 pp. Englisch.
Electronic Packaging for High Reliability, Low Cost Electronics
Belavic Darko Jones W.K. Tummala Rao Kosec Marija Tummala R.R.
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 269.40
US$ 11.35 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 328.
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 269.92
US$ 11.35 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 312.
