Fundamentals of Microsystems Packaging

Tummala, Rao

ISBN 10: 0071371699 / ISBN 13: 9780071371698

Published by McGraw-Hill Education, 2001

About this Item

This copy may contain significant wear, including bending, heavy writing, tears, and or water damage. This book is a functional copy, not necessarily a beautiful copy. Copy may have loose pages. May not include access codes or CDs. May be an Ex library book with stickers and stamps. Dustjacket may be missing.

Seller Inventory # GBV.0071371699.A

Bibliographic Details

• Title: Fundamentals of Microsystems Packaging
• Publisher: McGraw-Hill Education
• Publication Date: 2001
• Language: English
• ISBN 10: 0071371699
• ISBN 13: 9780071371698
• Binding: Hardcover
• Condition: acceptable

About this title

Synopsis

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:

*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing

About the Author

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.