Interconnect Reliability in Advanced Memory Device Packaging
Language: English
Published by Springer, 2023
Series: Book 86 of 90 - Springer Series in Reliability Engineering
- Softcover
- New

Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
AbeBooks seller since March 25, 2015
Condition: New
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In English.
Seller Inventory # ria9783031267093_new
- Title
- Interconnect Reliability in Advanced Memory Device Packaging
- Author
- Gan, Chong Leong; Huang, Chen-Yu
- Publisher
- Springer
- Publication year
- 2023
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 3031267095
- ISBN 13
- 9783031267093
- Item weight
- 450 grams
- Series
- Book 86 of 90: Springer Series in Reliability Engineering
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.
In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects.
This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
"Synopsis" may belong to another edition of this title.
Ria Christie Collections
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AbeBooks seller since March 25, 2015
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