Life-Time Estimation of Modern Power Electronics Devices: Power cycling capability of advanced packaging and interconnection technologies at high temperature swings

Raed Amro

ISBN 10: 3330852569 / ISBN 13: 9783330852563

Published by Noor Publishing, 2017

About this Item

136 pages. 8.66x5.91x0.31 inches. In Stock.

Seller Inventory # 3330852569

Bibliographic Details

• Title: Life-Time Estimation of Modern Power Electronics Devices: Power cycling capability of advanced packaging and interconnection technologies at high temperature swings
• Publisher: Noor Publishing
• Publication Date: 2017
• Language: English
• ISBN 10: 3330852569
• ISBN 13: 9783330852563
• Binding: Paperback
• Condition: Brand New
• Weight: 0.25 kilograms

About this title

Synopsis

Due to the increasing advancements in power devices, especially in Insulated Gate Bipolar Transistors (IGBT) technology, switching of kV and kA within μs is possible. Thereby a dissipation power up to 400W per chip is generated. Compared to the switched power, the dissipated power is still marginal. However, considering the area within this power is generated (< 2cm2), a significant heat density and thus high temperature especially within the chip is generated. To keep the maximal junction temperature (Tj,max) within the allowed range, reliable, thermally convenient packaging and interconnection concepts are necessary. Furthermore, power devices find increasingly application in automobile industry, where they have to fulfil high reliability requirements under harsh environmental conditions during their service lifetime of approx. 15 years.

About the Author

Dr Raed Amro holds a doctoral degree in electrical engineering from the Technical University of Chemnitz in Germany.works as Professor at Palestine Polytechnic University in Hebron-Palestine.