Raed Amro (6 results)
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 106.19
US$ 13.25 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. 136 pages. 8.66x5.91x0.31 inches. In Stock.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 56.37
US$ 79.89 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Life-Time Estimation of Modern Power Electronics Devices | Power cycling capability of advanced packaging and interconnection technologies at high temperature swings | Raed Amro | Taschenbuch | 136 S. | Englisch | 2017 | Noor Publishing | EAN 9783330852563 | Verantwortliche Person für die EU: preigu…GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 65.72
US$ 26.25 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Due to the increasing advancements in power devices, especially in Insulated Gate Bipolar Transistors (IGBT) technology, switching of kV and kA within mis is possible. Thereby a dissipation power up to 400W per chip is generated. Co…mpared to the switched power, the dissipated power is still marginal. However, considering the area within this power is generated ( 2cm2), a significant heat density and thus high temperature especially within the chip is generated. To keep the maximal junction temperature (Tj,max) within the allowed range, reliable, thermally convenient packaging and interconnection concepts are necessary. Furthermore, power devices find increasingly application in automobile industry, where they have to fulfil high reliability requirements under harsh environmental conditions during their service lifetime of approx. 15 years. 136 pp. Englisch.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 54.29
US$ 55.91 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Amro RaedDr Raed Amro holds a doctoral degree in electrical engineering from the Technical University of Chemnitz in Germany.works as Professor at Palestine Polytechnic University in Hebron-Palestine.Du…e to the increasing advanc.
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
US$ 65.72
US$ 68.48 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Due to the increasing advancements in power devices, especially in Insulated Gate Bipolar Transistors (IGBT) technology, switching of kV and kA within ¿s is possible. Thereby a dissipation power up to 400W per chip is generated. Compare…d to the switched power, the dissipated power is still marginal. However, considering the area within this power is generated (Books on Demand GmbH, Überseering 33, 22297 Hamburg 136 pp. Englisch.
- Softcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 66.50
US$ 69.75 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Due to the increasing advancements in power devices, especially in Insulated Gate Bipolar Transistors (IGBT) technology, switching of kV and kA within mis is possible. Thereby a dissipation power up to 400W per chip is generated. Compare…d to the switched power, the dissipated power is still marginal. However, considering the area within this power is generated ( 2cm2), a significant heat density and thus high temperature especially within the chip is generated. To keep the maximal junction temperature (Tj,max) within the allowed range, reliable, thermally convenient packaging and interconnection concepts are necessary. Furthermore, power devices find increasingly application in automobile industry, where they have to fulfil high reliability requirements under harsh environmental conditions during their service lifetime of approx. 15 years.
