Low-Power Deep Sub-Micron CMOS Logic : Sub-threshold Current Reduction

Language: English

Published by Humana, 2012

1475710577 / 9781475710571

Series: Book 108 of 260 - The Springer International Series in Engineering and Computer Science

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - 1. 1 Power-dissipation trends in CMOS circuits Shrinking device geometry, growing chip area and increased data-processing speed performance are technological trends in the integrated circuit industry to enlarge chip functionality. Already in 1965 Gordon Moore predicted that the total number of devices on a chip would double every year until the 1970s and every 24 months in the 1980s. This prediction is widely known as 'Moore's Law' and eventually culminated in the Semiconductor Industry Association (SIA) technology road map [1]. The SIA road map has been a guide for the in dustry leading them to continued wafer and die size growth, increased transistor density and operating frequencies, and defect density reduction. To mention a few numbers; the die size increased 7% per year, the smallest feature sizes decreased 30% and the operating frequencies doubled every two years. As a consequence of these trends both the number of transistors and the power dissi pation per unit area increase.In the near future the maximum power dissipation per unit area will be reached. Down-scaling of the supply voltage is not only the most effective way to reduce power dissipation in general it also is a necessary precondition to ensure device reliability by reducing electrical fields and device temperature, to prevent device degradation. A draw-back of this solution is an increased signal propa gation delay, which results in a lower data-processing speed performance.…

Seller Inventory # 9781475710571

Title
Low-Power Deep Sub-Micron CMOS Logic : Sub-threshold Current Reduction
Author
A. van Staveren
Publisher
Humana
Publication year
2012
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
1475710577
ISBN 13
9781475710571
Item weight
271 grams
Dimensions
235x155x10 mm
Series
Book 108 of 260: The Springer International Series in Engineering and Computer Science

AHA-BUCH GmbH

Einbeck, Germany

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