Microelectronics Packaging Handbook : Subsystem Packaging

Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)

ISBN 10: 0412084511 ISBN 13: 9780412084515
Published by Springer, 1997
Language: English
Condition: Used - As new Hardcover

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