Microelectronics Packaging Handbook
Language: English
Published by Springer, 1988
- Hardcover
- New
Hardcover
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Seller Inventory # 0442205783
- Title
- Microelectronics Packaging Handbook
- Author
- Tummala, R.R.
- Publisher
- Springer
- Publication year
- 1988
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0442205783
- ISBN 13
- 9780442205782
Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
"Synopsis" may belong to another edition of this title.
About the Author
Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.
"About the title" may belong to another edition of this title.
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