Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Volume 2.

Wymyslowski, Artur et al. (Eds.)

ISBN 10: 3319128612 / ISBN 13: 9783319128610

Published by Cham, Springer International Publishing., 2015

About this Item

235 mm x 155 mm. X, 194 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.

Seller Inventory # 3979FB

Bibliographic Details

• Title: Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Volume 2.
• Publisher: Cham, Springer International Publishing.
• Publication Date: 2015
• Language: English
• ISBN 10: 3319128612
• ISBN 13: 9783319128610
• Binding: Hardcover
• Seller catalogs:
  • Technik

About this title

Synopsis

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

From the Back Cover

This book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction.

This book also:

Discusses multiscale modeling of materials at the mesoscale

Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties

Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties