Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Language: English

Published by Springer Netherlands, 1993

185166579X / 9781851665792

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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent J.

Seller Inventory # 4289215

Title
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
Author
K. Otsuka
Publisher
Springer Netherlands
Publication year
1993
Condition
New
Binding
Gebunden
Language
English
ISBN 10
185166579X
ISBN 13
9781851665792

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
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Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268