Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Language: English

Published by Springer Netherlands, Springer Netherlands Apr 1993, 1993

185166579X / 9781851665792

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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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This item is printed on demand - Print on Demand Titel. Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 260 pp. Englisch.

Seller Inventory # 9781851665792

Title
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
Author
K. Otsuka
Publisher
Springer Netherlands, Springer Netherlands Apr 1993
Publication year
1993
Condition
Neu
Binding
Buch
Language
English
ISBN 10
185166579X
ISBN 13
9781851665792
Item weight
559 grams
Dimensions
241x160x19 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

5-star seller

AbeBooks seller since January 23, 2017

Shipping rates from Germany to U.S.A.

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Impressum Thorsten Retsch Buchversand Mimpf2000 Oberölschnitz 16 95517 Emtmannsberg Deutschland Telefon: 09209-2023188 Email: mimpf2000@online.de USt-ID-Nr.: DE 235096871 Wir führen gebrauchte Bücher aus allen Sparten der Literatur

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