Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan

K. Otsuka

ISBN 10: 185166579X / ISBN 13: 9781851665792

Published by Springer Netherland, 1993

About this Item

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan | K. Otsuka | Buch | xiv | Englisch | 1993 | Springer Netherland | EAN 9781851665792 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.

Seller Inventory # 101952496

Bibliographic Details

• Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan
• Publisher: Springer Netherland
• Publication Date: 1993
• Language: English
• ISBN 10: 185166579X
• ISBN 13: 9781851665792
• Binding: Buch
• Condition: Neu
• Dimensions: 241W x 160H x 19D millimeters 241 millimeters width by 160 millimeters height by 19 millimeters depth
• Weight: 559 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

Language Notes

Text: English (translation)
Original Language: Japanese