Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module Otsuka, K.

Otsuka, K.

ISBN 10: 185166579X / ISBN 13: 9781851665792

Published by Springer, 1993

About this Item

Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module | Otsuka | Elsevier, 1991. In-8° cartonné, 242 pages. Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Très bon état général pour cet ouvrage. [NM37].

Seller Inventory # 1219S0T2YA5

Bibliographic Details

• Title: Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module Otsuka, K.
• Publisher: Springer
• Publication Date: 1993
• Language: English
• ISBN 10: 185166579X
• ISBN 13: 9781851665792
• Binding: Hardcover Apr 30, 1993
• Condition: Used: Good

About this title

Synopsis

This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

Language Notes

Text: English (translation)
Original Language: Japanese