Proficient Fin Shape for Microprocessor Cooling

Language: English

Published by LAP Lambert Academic Publishing Jan 2017, 2017

3659873659 / 9783659873652

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -Microprocessor has become the heart of home/office PC systems. The microprocessor device require electrical energy for their work, the electrical energy is converted into heat energy this may affect the performance of a microprocessor. Heat sink was used to control the temperature of microprocessor in permissible limit. There are various parameters like heat sink material, fin thickness, number of fins, spacing between two fins, base plate thickness and fin shape etc. which affects the performance of heat sink. Material is one of the parameter that increase heat transfer rate. If copper is used in place of aluminium then heat transfer rate increases but at the same time cost also increases. The heat sink base plate thickness is parameter for improvement. When the base plate thickness was increased, the heat sink performed better. However, there are space limitations for every heat sink in a computer. Also the increase in number of fin was not a solution for improving heat transfer. So the fin shape is the parameter which has been studied in this work for better results. 68 pp. Englisch.

Seller Inventory # 9783659873652

Title
Proficient Fin Shape for Microprocessor Cooling
Author
Pankaj Baviskar
Publisher
LAP Lambert Academic Publishing Jan 2017
Publication year
2017
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3659873659
ISBN 13
9783659873652
Item weight
119 grams
Dimensions
220x150x5 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 26.74US$ 26.74
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BuchWeltWeit Ludwig Meier e.K.

Germany