Title: Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Publisher: Intl Society of Hybrid
Publication Date: 1989
Language: English
ISBN 10: 0930815254
ISBN 13: 9780930815257
Binding: Hardcover
Condition: New
Weight: 15 ounces

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Hardcover Book - Wire Bonding in Microelectronics ISBN # 0-930815-25-4

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