Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
- Hardcover
- New
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
AbeBooks seller since April 17, 2008
Condition: New
US$ 141.19
Quantity: 1 available
Add to basketItem description from seller
In shrink wrap. Looks like an interesting title.
Seller Inventory # Q-0930815254
- Title
- Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
- Author
- Harman, George
- Publisher
- Intl Society of Hybrid
- Publication year
- 1989
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0930815254
- ISBN 13
- 9780930815257
- Item weight
- 15 ounces
- Dimensions
- 9x6x0
"Synopsis" may belong to another edition of this title.
BennettBooksLtd
Los Angeles, CA, U.S.A.
AbeBooks seller since April 17, 2008
Shipping rates within U.S.A.
| Item | 7 to 30 business days | 3 to 14 business days |
|---|---|---|
| First item | US$ 6.95 | US$ 9.95 |
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BennettBooksLtd
CA, U.S.A.
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