Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and . . Series in Electronic and Optical Materials)

E-H Wong, Y.-W. Mai

ISBN 10: 1845695283 / ISBN 13: 9781845695286

Published by Woodhead Publishing 2015-06-01, 2015

About this Item

Seller Inventory # 6666-ELS-9781845695286

Bibliographic Details

• Title: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and . . Series in Electronic and Optical Materials)
• Publisher: Woodhead Publishing 2015-06-01
• Publication Date: 2015
• Language: English
• ISBN 10: 1845695283
• ISBN 13: 9781845695286
• Binding: Hardcover
• Condition: New

About this title

Synopsis

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

• Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
• Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
• Includes program files and macros for additional study

About the Author

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia