Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Language: English

Published by Elsevier Science Mai 2015, 2015

1845695283 / 9781845695286

Series: Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. 482 pp. Englisch.

Seller Inventory # 9781845695286

Title
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Author
E-H Wong
Publisher
Elsevier Science Mai 2015
Publication year
2015
Condition
Neu
Binding
Buch
Language
English
ISBN 10
1845695283
ISBN 13
9781845695286
Item weight
927 grams
Dimensions
241x164x30 mm
Series
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

Item5 to 15 business days5 to 15 business days
First itemUS$ 26.74US$ 26.74
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BuchWeltWeit Ludwig Meier e.K.

Germany