Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture
Language: English
Published by Woodhead Publishing, 2015
Series: Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
- New
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
AbeBooks seller since April 17, 2013
Condition: New
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- Title
- Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture
- Author
- Wong, E-H; Mai, Y.-W.
- Publisher
- Woodhead Publishing
- Publication year
- 2015
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 1845695283
- ISBN 13
- 9781845695286
- Series
- Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
- Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
- Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
- Includes program files and macros for additional study
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Romtrade Corp.
STERLING HEIGHTS, MI, U.S.A.
AbeBooks seller since April 17, 2013
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