System on Package : Miniaturization of the Entire System

Rao Tummala

ISBN 10: 0071459065 / ISBN 13: 9780071459068

Published by Mcgraw Hill LLC Apr 2007, 2007

About this Item

Neuware - System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where 'systems' used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

Seller Inventory # 9780071459068

Bibliographic Details

• Title: System on Package : Miniaturization of the Entire System
• Publisher: Mcgraw Hill LLC Apr 2007
• Publication Date: 2007
• Language: English
• ISBN 10: 0071459065
• ISBN 13: 9780071459068
• Binding: Buch
• Condition: Neu
• Dimensions: 242W x 198H x 35D millimeters 242 millimeters width by 198 millimeters height by 35 millimeters depth
• Weight: 1394 grams

About this title

Synopsis

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.




System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

About the Author

Dr. Rao Tummala (Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the US for improving national competitiveness.