Paperback. Pub Date :2014-03-01 Pages: 403 Language: Chinese Publisher: Beijing University of Aeronautics and Astronautics Press TMS320C55x DSP Application Design (3rd Edition) five universities planning materials. TI's TMS320C55x series chips as an object. a systematic introduction to the basics of design methods developed DSP chip and DSP applications. The book is divided into 10 chapters. the main contents are: C55x hardware architecture and instruction; using assembly language. CC + + lan.

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Title: TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition)
Publisher: ???????????
Publication Date: 2014
Language: Chinese
ISBN 10: 7512414749
ISBN 13: 9787512414747
Binding: paperback
Condition: New

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