Thermal Management for Opto-electronics Packaging and Applications (Hardcover). This item is unavailable.

Language: English

Published by John Wiley & Sons Inc, New York, 2024

1119179270 / 9781119179276

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Hardcover. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

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Title
Thermal Management for Opto-electronics Packaging and Applications (Hardcover)
Author
Xiaobing Luo
Publisher
John Wiley & Sons Inc, New York
Publication year
2024
Condition
new
Binding
Hardcover
Language
English
ISBN 10
1119179270
ISBN 13
9781119179276

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