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Condition: New.
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Hardcover. Condition: Very Good. 1. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.
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Thermal Management for Opto-electronics Packaging and Applications (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2024
ISBN 10: 1119179270 ISBN 13: 9781119179276
Hardcover. Condition: new. Hardcover. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Thermal Management for Opto-electronics Packaging and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 133.58
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Thermal Management for Opto-electronics Packaging and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 134.12
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Condition: As New. Unread book in perfect condition.
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LED Packaging for Lighting Applications : Design, Manufacturing, and Testing
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
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Thermal Management for Opto-electronics Packaging and Applications
Language: English
Published by John Wiley and Sons Inc, US, 2024
ISBN 10: 1119179270 ISBN 13: 9781119179276
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
US$ 162.65
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Add to basketHardback. Condition: New. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
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US$ 154.45
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Add to basketCondition: New. pp. 400.
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Condition: New. Brand new! Please provide a physical shipping address.
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Thermal Management for Opto-electronics Packaging and Applications
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
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Add to basketCondition: New. 2024. 1st Edition. hardcover. . . . . .
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Thermal Management for Opto-electronics Packaging and Applications
Language: English
Published by John Wiley & Sons Inc, 2024
ISBN 10: 1119179270 ISBN 13: 9781119179276
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 145.26
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Add to basketHardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Condition: New. pp. 400 1st edition NO-PA16APR2015-KAP.
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Freeform Optics for Led Packages and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
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Condition: New. pp. xx + 352 Index.
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Thermal Management for Opto-electronics Packaging and Applications (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2024
ISBN 10: 1119179270 ISBN 13: 9781119179276
US$ 148.25
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Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: new. Hardcover. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Condition: New. 2024. 1st Edition. hardcover. . . . . . Books ship from the US and Ireland.
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Condition: New. Brand new! Please provide a physical shipping address.
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Freeform Optics for Led Packages and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 202.72
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Condition: New. 352.
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US$ 231.24
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Add to basketCondition: New. 352.
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Thermal Management for Opto-electronics Packaging and Applications
Language: English
Published by John Wiley and Sons Inc, US, 2024
ISBN 10: 1119179270 ISBN 13: 9781119179276
US$ 154.85
US$ 87.04 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
-
LED Packaging for Lighting Applications : Design, Manufacturing, and Testing
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 246.87
US$ 20.09 shipping
Ships from United Kingdom to U.S.A.Quantity: 5 available
Add to basketCondition: As New. Unread book in perfect condition.
