Alfred Gall (62 results)
Language: English
Published by Grove Press/Grove Press, Inc., New York, 1999
- Softcover
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Trade Paperback. Condition: Very Good. Copyright © 1964 by Grove Press, Inc. 256 pp. Solidly and tightly bound copy with moderate external, but minimal internal wear and use. Copy with crisp and bright pages. Occasional pencil markings and marginalia on text. Smooth covers. Mildly or minimally shelf worn. John Gall (Cover Design…); Alfred Gescheidt/Image Bank (Cover Illustration) (illustrator).
Language: English
Published by Grove Press/Grove Press, Inc., New York, 1999
- Softcover
Seller: gearbooks, The Bronx, NY, U.S.A.gearbooks
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Trade Paperback. Condition: Very Good. Copyright © 1964 by Grove Press, Inc. 256 pp. Solidly and tightly bound copy with moderate external, but minimal internal wear and use. Copy with clean text on crisp and bright pages. Smooth covers. Mildly or minimally shelf worn. Minimal, light or very mild discoloration/browning/tanning o…r foxing on page edges, not affecting text. John Gall (Cover Design); Alfred Gescheidt/Image Bank (Cover Illustration) (illustrator).
Historische zeitschrift, Sonderheft 7: Italien Im Mittelalter : Neuerscheinungen Von 1959-1975
Historische Zeitschrift; schieder, Theodor (ed.); Gall, Lothar (ed.); Haverkamp, Alfred; enzensberger, Horst
Published by R. Oldenbourg, Munchen, 1980
- Hardcover
- First Edition
Seller: PsychoBabel & Skoob Books, Didcot, United KingdomPsychoBabel & Skoob Books
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Hardcover. Condition: Very Good. No Dust Jacket. First Edition. Library-bound in solid, brown cloth. Gilt titles on spine. Bookplate on FEP; accession stamps. Contents otherwise clean and sound throughout. TPW. Ex Library.
Published by Aachen, 1973
- Softcover
Seller: Wissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG, Köln, GermanyWissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG
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Broschur. Condition: gut. VI, 139 S. : mit Abb., 21 cm, Deckblatt mit handschr. Markierungen, Ecke leicht geknickt, Lichtrand, Bibliotheksexemplar. Sprache: deu.
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
- Hardcover
Seller: medimops, Berlin, Germanymedimops
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Condition: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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Paperback. Condition: New.
- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 204.
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-…values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U)… Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 174.90
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Published by R. Oldenbourg München,, 1980
Seller: Bernhard Kiewel Rare Books, Grünberg, GermanyBernhard Kiewel Rare Books
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US$ 9.43
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23 x 16. VIII, 494 Seiten. Fachmännisch neu eingebunden in Hardcovereinband mit goldgeprägtem Rückentitel. Guter Zustand. Sprache: Deutsch Gewicht in Gramm: 691.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. viii + 189.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, Martin (EDT); Grill, Alfred (EDT); Lacopi, Francesca (EDT); Koike, Junichi (EDT); Usui, Takamasa (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Gall, M. (Editor)/ Grill, A. (Editor)/ Lacopi, F. (Editor)/ Koike, J. (Editor)/ Usui, T. (Editor)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Edited by Martin Gall , Alfred Grill , Francesca Lacopi , Junichi Koike , Takamasa Usui
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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US$ 198.87
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Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U)… Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values…and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
- Hardcover
Seller: SKULIMA Wiss. Versandbuchhandlung, Westhofen, GermanySKULIMA Wiss. Versandbuchhandlung
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Condition: Neu. Polnisches Paradigma, europäischer Kontext, deutsch-polnische Perspektive. Hrsg. von Alfred Gall, Thomas Grob, Andreas Lawaty und German Ritz. Die Besonderheit der polnischen Romantik beruht nicht zuletzt auf einer besonderen Beziehung von Literatur und Geschichte. Dieser Nexus, der fast alle Aspekte der polnisch…en Romantik berührt, bildet den Rahmen des Sammelbandes, an dem programmatisch Literaturwissenschaftler und Historiker beteiligt sind. Die zwanzig Beiträge polnischer, deutscher und schweizerischer Autoren lassen sich zu drei Blöcken gruppieren: einem interdisziplinär thematischen zu Nationsbildungsprozessen und Modernisierung (Modernisierung: nation building und imagined community), einem komparatistisch poetologischen zu Imagination, Ironie und Intertextualität (Programmatik zwischen Individualisierung und Totalisierung), und schließlich einem kulturtypologischen und wirkungsgeschichtlichen, der über 'das Andere der Romantik' gefasst wird. 419 Seiten, gebunden (Veröffentlichungen des Nordost-Instituts; Band 8/Harrassowitz Verlag 2007). Statt EUR 38,00. Gewicht: 823 g - Gebunden/Gebundene Ausgabe.
Condition: New
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Condition: New. Juedische Leben erzaehlen versammelt Werkstattberichte von Autorinnen und Autoren biographischer Studien, die in jahrelanger, intensiver Beschaeftigung mit den Hinterlassenschaften von Menschen juedischer Herkunft deren Leben erfor.
Language: German
Published by Bremen, Franz Schlöodtmann, 1851
- Hardcover
- First Edition
Seller: ACADEMIA Antiquariat an der Universität, Freiburg, GermanyACADEMIA Antiquariat an der Universität
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Leinen. Condition: Gut. 1. Auflage. 471 Seiten dunkelbrauner Band mit Goldtitelprägung, Ganzgoldschnitt und Goldverzierung; Rücken / Deckel gelockert (leicht auszubessern); sonst und insgesamtgutes Exempalr mit Novellen von Max Waldau, Louise von Gall, Heinrich Pröhle, Adolf Sathr, Bernd von Guseck, Alfred Meißner, und Anonymus…Sprache: Deutsch Gewicht in Gramm: 1.
Published by Evangelische Akademie Baden Öffentlichkeitsarbeit
- Softcover
Seller: Buchpark, Trebbin, GermanyBuchpark
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Condition: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Romantik und Geschichte. Polnisches Paradigma, europäischer Kontext, deutsch-polnische Perspektive | Alfred Gall (u. a.) | Taschenbuch | Veröffentlichungen des Nordost-Instituts, Bd. 8 | 419 S. | Deutsch | 2007 | Harrassowitz Verlag | EAN 9783447056540 | Verantwortliche Person für die EU: Harrassowit…z Verlag GmbH & [.], Steffen Schickling, Kreuzberger Ring 7C-D, 65205 Wiesbaden, produktsicherheit[dot]verlag[at]harrassowitz[dot]de | Anbieter: preigu.
