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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsUS$ 237.45
US$ 8.58 shipping
Ships from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New. pp. 434.
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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 282.63
US$ 19.80 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 296.19
US$ 15.81 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: As New. Unread book in perfect condition.
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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 328.63
US$ 19.80 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsUS$ 309.91
US$ 55.81 shipping
Ships from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design P.
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsUS$ 245.08
US$ 16.50 shipping
Ships from United Kingdom to U.S.A.Quantity: 2 available
Add to basketPaperback. Condition: Brand New. 425 pages. 8.75x6.00x1.00 inches. In Stock. This item is printed on demand.
