Choi Chulchae (11 results)

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  • Language: English

    Published by Morgan and Claypool Publishers, 2007

    1598290665 / 9781598290660

    • Softcover

    Seller: BookOrders, Russell, IA, U.S.A.BookOrders

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    Condition: Used - Very good

    US$ 30.00

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    Soft Cover. Condition: Very Good. Ex-library with the usual features. Library label on front cover. The interior is clean and tight. Binding is good. Cover shows light wear.

  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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    Condition: New

    US$ 41.81

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  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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    Condition: As New. Unread book in perfect condition.

  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections

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    Condition: New

    US$ 48.02

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    Condition: New. In English.

  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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    Condition: New

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    Condition: New. 1st edition NO-PA16APR2015-KAP.

  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK

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  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover

    Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK

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  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover
    • Print on Demand

    Seller: Majestic Books, Hounslow, United KingdomMajestic Books

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    Condition: New

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  • Language: English

    Published by Springer International Publishing Dez 2007, 2007

    3031014251 / 9783031014253

    • Softcover
    • Print on Demand

    Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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    Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing. 104 pp. Englisch.…

  • Language: English

    Published by Springer, 2007

    3031014251 / 9783031014253

    • Softcover
    • Print on Demand

    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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    Condition: New. PRINT ON DEMAND.

  • Language: English

    Published by Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2007

    3031014251 / 9783031014253

    • Softcover
    • Print on Demand

    Seller: moluna, Greven, Germanymoluna

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    Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices .…