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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.84
US$ 16.22 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Introduction to Microelectronics Advanced Packaging Assurance
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 70.83
US$ 20.31 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Introduction to Microelectronics Advanced Packaging Assurance
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 77.99
US$ 20.31 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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US$ 93.71
US$ 16.92 shipping
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Add to basketHardcover. Condition: Brand New. 200 pages. 9.44x6.61x9.61 inches. In Stock.
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.
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Condition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. In addition, this book: o Provides a thorough introduction to IC packaging evolution and prospects, from historical evolution to emerging trendso Includes case studies and examples, bridging theoretical knowledge with real applications for professionalso Explores quantum computing integration and wearable device packaging, offering insight into future industry directions.
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Introduction to Microelectronics Advanced Packaging Assurance
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. 204 pp. Englisch.
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Condition: New. Print on Demand.
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Condition: New. PRINT ON DEMAND.
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Introduction to Microelectronics Advanced Packaging Assurance
Language: English
Published by Springer Verlag GmbH, 2025
ISBN 10: 3031861019 ISBN 13: 9783031861017
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.
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Introduction to Microelectronics Advanced Packaging Assurance
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. 204 pp. Englisch.
