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Published by Springer Nature Switzerland AG, CH, 2024
ISBN 10: 3030861767 ISBN 13: 9783030861766
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Published by Springer Nature Switzerland AG, Cham, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Hardcover. Condition: new. Hardcover. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Published by Springer International Publishing, Springer Nature Switzerland, 2024
ISBN 10: 3030861767 ISBN 13: 9783030861766
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.
Language: English
Published by Springer Nature Switzerland AG, CH, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Published by Springer Nature Switzerland AG, CH, 2024
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Published by Springer, Berlin|Springer International Publishing|Springer, 2022
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Condition: New. This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured.
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Condition: Hervorragend. Zustand: Hervorragend | Seiten: 396 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Published by Springer International Publishing, Springer International Publishing Jan 2023, 2023
ISBN 10: 3030861732 ISBN 13: 9783030861735
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Buch. Condition: Neu. Neuware -This book discusses the significant aspects of thermal transient testing, the most important method of thermal characterization of electronics available today. The book presents the theoretical background of creating structure functions from the measured results with mathematical details. It then shows how the method can be used for thermal qualification, structure integrity testing, determining material parameters, and calibrating simulation models. General practical questions about measurements are discussed to help beginners carry out thermal transient testing. The particular problems and tricks of measuring with various electronic components, such as Si diodes, bipolar transistors, MOS transistors, IGBT devices, resistors, capacitors, wide bandgap materials, and LEDs, are covered in detail with the help of various use cases. This hands-on book will enable readers to accomplish thermal transient testing on any new type of electronics and provides the theoretical details needed tounderstand the opportunities and limitations offered by the methodology. The book will be an invaluable reference for practicing engineers, students, and researchers.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 396 pp. Englisch.
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Add to basketHardcover. Condition: Brand New. 394 pages. 9.25x6.10x0.88 inches. In Stock.