Gregory Henshall (17 results)
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
US$ 100.50
US$ 3.75 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
US$ 116.06
US$ 2.64 shippingShips within U.S.A.Quantity: 8 available
Condition: New.
- Hardcover
Seller: INDOO, Avenel, NJ, U.S.A.INDOO
Contact seller5-star sellerCondition: New
US$ 118.71
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
US$ 134.03
US$ 2.64 shippingShips within U.S.A.Quantity: 8 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
US$ 144.07
US$ 6.63 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
- First Edition
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contact seller5-star sellerCondition: New
US$ 147.49
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic p…roperties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
Contact seller5-star sellerCondition: New
US$ 153.80
Free ShippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardback. Condition: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of… local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
US$ 139.71
US$ 19.80 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Condition: As New. Unread book in perfect condition.
Lead-Free Solder Process Development
Henshall, Gregory (EDT); Bath, Jasbir (EDT); Handwerker, Carol A. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
US$ 144.06
US$ 19.80 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Condition: New.
- Hardcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
US$ 151.73
US$ 20.45 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: New.
- Hardcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
Contact seller5-star sellerCondition: New
US$ 150.05
US$ 22.22 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
- Hardcover
Seller: Ubiquity Trade, Miami, FL, U.S.A.Ubiquity Trade
Contact seller4-star sellerCondition: New
US$ 173.15
US$ 3.00 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New. Brand new! Please provide a physical shipping address.
- Hardcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 167.33
US$ 11.96 shippingShips from Ireland to U.S.A.Quantity: 1 available
Condition: New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain ar…eas on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . .
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
US$ 198.60
US$ 10.50 shippingShips within U.S.A.Quantity: 1 available
Condition: New. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain ar…eas on reliability. Num Pages: 284 pages, Illustrations. BIC Classification: THX; TJF. Category: (P) Professional & Vocational. Dimension: 213 x 161 x 22. Weight in Grams: 580. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
- Hardcover
- First Edition
Seller: CitiRetail, Stevenage, United KingdomCitiRetail
Contact seller5-star sellerCondition: New
US$ 163.81
US$ 48.84 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic p…roperties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
Contact seller5-star sellerCondition: New
US$ 149.39
US$ 85.80 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardback. Condition: New. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of… local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
- Hardcover
- First Edition
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contact seller5-star sellerCondition: New
US$ 234.82
US$ 37.00 shippingShips from Australia to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic p…roperties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distributionExamines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries. This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
