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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (Hardcover)
Language: English
Published by John Wiley & Sons Inc, Hoboken, 2022
ISBN 10: 1119793777 ISBN 13: 9781119793779
Hardcover. Condition: new. Hardcover. Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
US$ 156.19
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 150.83
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Embedded and Fan-out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-package
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 152.20
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2019
ISBN 10: 1119314135 ISBN 13: 9781119314134
Hardcover. Condition: new. Hardcover. Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development resultsContent relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 164.79
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Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 159.12
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Embedded and Fan-out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-package
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
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Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
Language: English
Published by Mechanical Industry Press, 2024
ISBN 10: 7111755804 ISBN 13: 9787111755807
paperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Language: English
Published by John Wiley and Sons Inc, US, 2022
ISBN 10: 1119793777 ISBN 13: 9781119793779
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
Language: English
Published by John Wiley and Sons Ltd, 2021
ISBN 10: 1119793777 ISBN 13: 9781119793779
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 172.64
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Add to basketHardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Language: English
Published by John Wiley and Sons Ltd, 2019
ISBN 10: 1119314135 ISBN 13: 9781119314134
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
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Add to basketHardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
Language: English
Published by John Wiley & Sons Inc, 2019
ISBN 10: 1119314135 ISBN 13: 9781119314134
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
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Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2019
ISBN 10: 1119314135 ISBN 13: 9781119314134
US$ 164.80
US$ 50.39 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: new. Hardcover. Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development resultsContent relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (Hardcover)
Language: English
Published by John Wiley & Sons Inc, Hoboken, 2022
ISBN 10: 1119793777 ISBN 13: 9781119793779
US$ 166.20
US$ 50.39 shipping
Ships from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: new. Hardcover. Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
-
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
Language: English
Published by John Wiley & Sons Inc, 2022
ISBN 10: 1119793777 ISBN 13: 9781119793779
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
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US$ 173.55
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Add to basketCondition: New. Beth Keser, PhD, is an IEEE Fellow and Distinguished Lecturer with over 23 years experience in the semiconductor industry and a co-Editor of Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Beth s excellence in developing revolutionary .
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Add to basketGebunden. Condition: New. Beth Keser, Ph.D., is a recognized global leader in the semiconductor industry with over 20 years experience resulting in 28 patents and patents pending and over 40 publications. She is an IEEE Senior Member whose volunteer activities and professional soci.
