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Krishna Tunga (12 results)
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Study of SnAgCu Alloy Reliability
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
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Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
Language: English
Published by VDM Verlag 2009-03-15, 2009
ISBN 10: 3639133277 ISBN 13: 9783639133271
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Study of Snagcu Alloy Reliability
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Study of Snagcu Alloy Reliability
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Study of SnAgCu Alloy Reliability | Material Microstructural Evolution and Laser Moire Interferometry
Language: English
Published by VDM Verlag Dr. Müller, 2009
ISBN 10: 3639133277 ISBN 13: 9783639133271
Taschenbuch. Condition: Neu. Study of SnAgCu Alloy Reliability | Material Microstructural Evolution and Laser Moire Interferometry | Krishna Tunga | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2009 | VDM Verlag Dr. Müller | EAN 9783639133271 | Verantwortliche Person für die EU: OmniScriptum GmbH & Co. KG, Bahnhofstr. 28, 66111 Saarbrücken, info[at]akademikerverlag[dot]de | Anbieter: preigu.
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Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Study of SnAgCu Alloy Reliability Material Microstructural Evolution and Laser Moire Interferometry
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
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Study of SnAgCu Alloy Reliability : Material Microstructural Evolution and Laser Moire Interferometry
Language: English
Published by VDM Verlag Dr. Müller, 2009
ISBN 10: 3639133277 ISBN 13: 9783639133271
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This work aims to understand the reliability ofSnAgCu solder interconnects used in PBGA packagesusing microstructure evolution, laser moiréinterferometry and finite-element modeling. Aparticle coarsening based microstructure evolution ofthe solder joint material during thermal excursionswas studied for extended periods of time lasting forseveral months. The microstructure evolution andparticle coarsening was quantified, and accelerationfactors were determined between benign field-useconditions and ATC conditions for PBGA packages withdifferent form factors and for two differentlead-free solder alloys. A new technique using lasermoiré interferometry was developed to assess thedeformation behavior of SnAgCu based solder jointsduring thermal excursions. This technique can used toestimate the fatigue life of solder joints quickly ina matter offew days instead of months. FEA in conjunction withexperimental data from the ATC for differentlead-free PBGA packages was used to develop a fatiguelife model that can be used to predict solder jointfatigue life for any PBGA package.
