Leventhal Roy (20 results)

Paperback. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

Hardcover. Condition: Very Fine. Dust Jacket Condition: Very Fine. No markings.

Condition: New.

Gebunden. Condition: New.

Condition: New. In English.

Condition: New. In English.

Taschenbuch. Condition: Neu. Semiconductor Modeling: | For Simulating Signal, Power, and Electromagnetic Integrity | Roy Leventhal (u. a.) | Taschenbuch | xx | Englisch | 2014 | Springer | EAN 9781489991379 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers - both recent graduates and working product designers - in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try.Highlights include:- Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits.- Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems.- Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.…

Condition: New. pp. 766.

Condition: New. pp. 792.

Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: new. Questo è un articolo print on demand.

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Discusses process variation, model accuracy, design flow and many other practical engineering, reliability and manufacturing issuesGives a good overview for a person who is not an expert in modeling and simulation, enabling them to extract the necessary information to competently use modeling and simulation programsWritten for engineering students and product design engineers 792 pp. Englisch.…

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Semiconductor Modeling: For Simulating Signal, Power, and Electromagnetic Integrity assists engineers ¿ both recent graduates and working product designers ¿ in designing high-speed circuits. The authors apply circuit theory, circuit simulation tools, and practical experience to help the engineer understand semiconductor modeling as applied to high-speed digital designs. The emphasis is on semiconductor modeling, with PCB transmission line effects, equipment enclosure effects, and other modeling issues discussed as needed. The text addresses many practical considerations, including process variation, model accuracy, validation and verification, signal integrity, and design flow. Readers will benefit from its survey of modeling for semiconductors, packages, and interconnects, along with usable advice on how to get complex, high-speed prototypes to work on the first try.Highlights include: Presents a very complete and well-balanced treatment of modeling of semiconductors, packages, and interconnects. Facilitates reader comprehension of the whole field of high-speed modeling, including digital and RF circuits. Combines practical modeling techniques with the latest EDA tools for simulation and successful high-speed digital design. Facilitates resolution of practical, every-day problems. Presents modeling from its historical roots to current state of the art. Facilitates keeping abreast of the latest modeling developments as they continue to unfold.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 792 pp. Englisch.…

Condition: New. Print on Demand pp. 766.

Condition: New. PRINT ON DEMAND pp. 766.

Condition: New. Print on Demand pp. 792 Illus.

Condition: New. PRINT ON DEMAND pp. 792.