Mergui Sylvia (21 results)

Hardcover. Condition: Good. No d/j. Kluwer Academic Publishers, 1995. Hardback, 8vo, x,318pp, illust. Boards slightly bumped and faded. A good copy. 0792334604/0.8ne.

Condition: New. In English.

Condition: New. In English.

Condition: New. Proceedings of the NATO Advanced Research Workshop on 'Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994 Editor(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia. Series: NATO Science Partnership Subseries: 3. Num Pages: 318 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 19. Weight in Grams: 1420. . 1995. Hardback. . . . .…

Condition: New. pp. x + 318.

Condition: New. pp. 332.

Paperback. Condition: Brand New. 318 pages. 9.44x6.31x0.75 inches. In Stock.

Condition: New. Proceedings of the NATO Advanced Research Workshop on 'Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994 Editor(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia. Series: NATO Science Partnership Subseries: 3. Num Pages: 318 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 19. Weight in Grams: 1420. . 1995. Hardback. . . . . Books ship from the US and Ireland.…

Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.…

Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.…

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. 332 pp. Englisch.…

Taschenbuch. Condition: Neu. MCM C/Mixed Technologies and Thick Film Sensors | W. K. Jones (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2012 | Springer Netherland | EAN 9789401040396 | Verantwortliche Person für die EU: Springer Netherlands, Haberstr. 7, 69126 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: preigu Print on Demand. …

Buch. Condition: Neu. MCM C/Mixed Technologies and Thick Film Sensors | W. K. Jones (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1995 | Springer Netherland | EAN 9780792334606 | Verantwortliche Person für die EU: Springer Netherlands, Haberstr. 7, 69126 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: preigu Print on Demand. …

Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. 332 pp. Englisch.…

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 332 pp. Englisch.…

Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity.MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 332 pp. Englisch.…

Condition: New. Print on Demand pp. x + 318.

Condition: New. Print on Demand pp. 332 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condition: New. PRINT ON DEMAND pp. x + 318.

Condition: New. PRINT ON DEMAND pp. 332.