Proes (25 results)

Soft cover. Condition: Good +. Third Printing. 120 pages. Yelow binding with black lettering on spine and front cover. Light soiling to front cover. Book store stamp at bottom of half title page. About 1/3 rd of the pages have underlining. Photos on request.

Soft Cover. Condition: Very Good. Trade Paperback.

Paperback. Condition: Very Good. 1st Edition. Very Good condition Softcover Octavo, 1987, First Edition, Third Printing. Soft crease in back cover corner. Size: 8vo - over 7" - 9" tall. Book.

Softbound. Condition: Good used Condition. Privately printed, 106 pages, light overall shelfwear, clean inside. Inscirbed on half-title page by Anne (Serena). signed Size: 8vo - over 7¾" - 9¾" tall. Inscribed By Author.

Condition: New.

Condition: As New. Unread book in perfect condition.

Paperback. Condition: new. Paperback. In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products.The development for this process chain is based on an extensive literature review that indicates that an SLS-based process chain has great potential to produce 3-dimensional electronic devices with properties and with the future perspective of being suitable for an individualized mass production. The biggest, initial, technical hurdle is an unstable SLS process using a conventional LDS additive. The compound of SLS material and LDS additive was analyzed with DSC, which shows that the additive changes the melting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size and content for the metal powder an analytical material model is provided, that predicts the additive particle distribution within the material. This material model deepens the understanding of the activation mechanism during laser activation, provides hands-on information for powder preparation and it is applied for the design of the experiment for the development of the process chain with the new material.Preliminary experiments are conducted along with the insights of the material model, which prove that redeposition is the main activation mechanism during laser activation with fine metal powders. Based on this, the process chain is developed, starting with a determination of a suitable additive content. A suitable material composition of a PA12 powder containing 2 wt.% of a copper powder with a mean particle diameter of 3.5 mm was identified. With regard to the laser activation, working laser parameters are developed (working parameter set feasible for all used post-process treatments: PRF = 1 kHz, dh = 25 mm, vs = 25 mm/s, tl = 20ns and P = 1.07 W). In this parameter development it is shown, that only closely located laser spots, enabling interaction of the laser pulses, are capable of activating the surface, while single laser pulses under applied conditions are not. By adding a post-process treatment as additional process step into the process chain, the quality of metallization and the size of design features could be improved. Chemical smoothing resulted in a complete reduction of unwanted metallization on non-activated surfaces. Conductor tracks with the minimal width of 300 mm could be realized. The process chain could be applied to demonstrator parts such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised the technology readiness level (TRL) from TRL2 to TRL6.Finally, an economic consideration provides insights on the cost structure of parts produced with the AMMID process. A comparison of AMMID and injection molding shows economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts in case of the PSU panel. Finally, the analysis of the cost structure gives advice which future developments in the process chain have the greatest effect on costs and provides prioritization. In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Hardcover. Condition: Very Good. No Jacket. Black cloth 4to, no jacket, pp.84 + multiple ( 28 ) appendices at rear. Bw photographic ills, diagrams and charts, many folding. Ex libris from the British Hat & Allied Feltmakers Research Association Library, with light dewey numbers on spine and stamp on front pastedown. In summary, this investigation was carried out to examine production planning problems common in Trimming Rooms of Hat Factories, and to determine a methodology which might be followed by the industry for investigations into production planning in its widest sense. . Much fascinating insight into the rarely exposed inner workings of the Felt Hat industry. Cloth slightly worn. Several of the folding plates have old yellowed cellotape reinforcement to the fold, else text clean and tight. VG Size: 4to - over 9¾" - 12" tall.

Condition: New.

Paperback. Condition: Brand New. 233 pages. 9.45x6.61x0.47 inches. In Stock.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products.The development for this process chain is based on an extensive literature review that indicates that an SLS-based process chain has great potential to produce 3-dimensional electronic devices with properties and with the future perspective of being suitable for an individualized mass production. The biggest, initial, technical hurdle is an unstable SLS process using a conventional LDS additive. The compound of SLS material and LDS additive was analyzed with DSC, which shows that the additive changes the melting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size and content for the metal powder an analytical material model is provided, that predicts the additive particle distribution within the material. This material model deepens the understanding of the activation mechanism during laser activation, provides hands-on information for powder preparation and it is applied for the design of the experiment for the development of the process chain with the new material.Preliminary experiments are conducted along with the insights of the material model, which prove that redeposition is the main activation mechanism during laser activation with fine metal powders. Based on this, the process chain is developed, starting with a determination of a suitable additive content. A suitable material composition of a PA12 powder containing 2 wt.% of a copper powder with a mean particle diameter of 3.5 mim was identified. With regard to the laser activation, working laser parameters are developed (working parameter set feasible for all used post-process treatments: PRF = 1 kHz, dh = 25 mim, vs = 25 mm/s, tl = 20ns and P = 1.07 W). In this parameter development it is shown, that only closely located laser spots, enabling interaction of the laser pulses, are capable of activating the surface, while single laser pulses under applied conditions are not. By adding a post-process treatment as additional process step into the process chain, the quality of metallization and the size of design features could be improved. Chemical smoothing resulted in a complete reduction of unwanted metallization on non-activated surfaces. Conductor tracks with the minimal width of 300 mim could be realized. The process chain could be applied to demonstrator parts such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised the technology readiness level (TRL) from TRL2 to TRL6.Finally, an economic consideration provides insights on the cost structure of parts produced with the AMMID process. A comparison of AMMID and injection molding shows economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts in case of the PSU panel. Finally, the analysis of the cost structure gives advice which future developments in the process chain have the greatest effect on costs and provides prioritization.

Taschenbuch. Condition: Neu. Additive Manufacturing of Mechatronic Integrated Devices | Friedrich Wilhelm Proes | Taschenbuch | Light Engineering für die Praxis | xxii | Englisch | 2022 | Springer | EAN 9783031162206 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Condition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products. The development for this process chain is based on an extensive literature review that indicates that an SLS-based process chain has great potential to produce 3-dimensional electronic devices with properties and with the future perspective of being suitable for an individualized mass production. The biggest, initial, technical hurdle is an unstable SLS process using a conventional LDS additive. The compound of SLS material and LDS additive was analyzed with DSC, which shows that the additive changes the melting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size and content for the metal powder an analytical material model is provided, that predicts the additive particle distribution within the material. This material model deepens the understanding of the activation mechanism during laser activation, provides hands-on information for powder preparation and it is applied for the design of the experiment for the development of the process chain with the new material. Preliminary experiments are conducted along with the insights of the material model, which prove that redeposition is the main activation mechanism during laser activation with fine metal powders. Based on this, the process chain is developed, starting with a determination of a suitable additive content. A suitable material composition of a PA12 powder containing 2 wt.% of a copper powder with a mean particle diameter of 3.5 ¿m was identified. With regard to the laser activation, working laser parameters are developed (working parameter set feasible for all used post-process treatments: PRF = 1 kHz, dh = 25 ¿m, vs = 25 mm/s, tl = 20ns and P = 1.07 W). In this parameter development it is shown, that only closely located laser spots, enabling interaction of the laser pulses, are capable of activating the surface, while single laser pulses under applied conditions are not. By adding a post-process treatment as additional process step into the process chain, the quality of metallization and the size of design features could be improved. Chemical smoothing resulted in a complete reduction of unwanted metallization on non-activated surfaces. Conductor tracks with the minimal width of 300 ¿m could be realized. The process chain could be applied to demonstrator parts such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised the technology readiness level (TRL) from TRL2 to TRL6. Finally, an economic consideration provides insights on the cost structure of parts produced with the AMMID process. A comparison of AMMID and injection molding shows economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts in case of the PSU panel. Finally, the analysis of the cost structure gives advice which future developments in the process chain have the greatest effect on costs and provides prioritization.

Paperback. Condition: Very Good. 1st Edition. Very Good condition Softcover Octavo, 1987, 1st edition presumed. Light general wear. RARE Size: 8vo - over 7" - 9" tall. Book.

Utrecht, Paddenburg et soc., 1833. Or. blue wrps., rebacked. XII, 138 pp. 8vo. Stamp on titlepage. Latin. Ex lib copy in good condition.

LeatherBound. Condition: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. LeatherBound edition. Condition: New. Reprinted from 1856 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. Pages: 33 NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 33.

LeatherBound. Condition: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. LeatherBound edition. Condition: New. Reprinted from 1853 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. Pages: 33 NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 33.

Condition: new. Questo è un articolo print on demand.

LeatherBound. Condition: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. LeatherBound edition. Condition: New. Reprinted from 1870 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. Pages: 337 NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 337.

LeatherBound. Condition: New. BOOKS ARE EXEMPT FROM IMPORT DUTIES AND TARIFFS; NO EXTRA CHARGES APPLY. LeatherBound edition. Condition: New. Reprinted from 1856 edition. Leather Binding on Spine and Corners with Golden leaf printing on spine. Bound in genuine leather with Satin ribbon page markers and Spine with raised gilt bands. A perfect gift for your loved ones. Pages: 337 NO changes have been made to the original text. This is NOT a retyped or an ocr'd reprint. Illustrations, Index, if any, are included in black and white. Each page is checked manually before printing. As this print on demand book is reprinted from a very old book, there could be some missing or flawed pages, but we always try to make the book as complete as possible. Fold-outs, if any, are not part of the book. If the original book was published in multiple volumes then this reprint is of only one volume, not the whole set. Sewing binding for longer life, where the book block is actually sewn (smythe sewn/section sewn) with thread before binding which results in a more durable type of binding. Pages: 337.

Drawing draft coat of arms Van Rinckhuyzen & Proes. Size 140 x 100 mm.  .

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products.The development for this process chain is based on an extensive literature review that indicates that an SLS-based process chain has great potential to produce 3-dimensional electronic devices with properties and with the future perspective of being suitable for an individualized mass production. The biggest, initial, technical hurdle is an unstable SLS process using a conventional LDS additive. The compound of SLS material and LDS additive was analyzed with DSC, which shows that the additive changes the melting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size and content for the metal powder an analytical material model is provided, that predicts the additive particle distribution within the material. This material model deepens the understanding of the activation mechanism during laser activation, provides hands-on information for powder preparation and it is applied for the design of the experiment for the development of the process chain with the new material.Preliminary experiments are conducted along with the insights of the material model, which prove that redeposition is the main activation mechanism during laser activation with fine metal powders. Based on this, the process chain is developed, starting with a determination of a suitable additive content. A suitable material composition of a PA12 powder containing 2 wt.% of a copper powder with a mean particle diameter of 3.5 mim was identified. With regard to the laser activation, working laser parameters are developed (working parameter set feasible for all used post-process treatments: PRF = 1 kHz, dh = 25 mim, vs = 25 mm/s, tl = 20ns and P = 1.07 W). In this parameter development it is shown, that only closely located laser spots, enabling interaction of the laser pulses, are capable of activating the surface, while single laser pulses under applied conditions are not. By adding a post-process treatment as additional process step into the process chain, the quality of metallization and the size of design features could be improved. Chemical smoothing resulted in a complete reduction of unwanted metallization on non-activated surfaces. Conductor tracks with the minimal width of 300 mim could be realized. The process chain could be applied to demonstrator parts such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised the technology readiness level (TRL) from TRL2 to TRL6.Finally, an economic consideration provides insights on the cost structure of parts produced with the AMMID process. A comparison of AMMID and injection molding shows economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts in case of the PSU panel. Finally, the analysis of the cost structure gives advice which future developments in the process chain have the greatest effect on costs and provides prioritization. 236 pp. Englisch.

Condition: New. Print on Demand.

Condition: New. PRINT ON DEMAND.

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 236 pp. Englisch.