Rohit Singhal (8 results)
Unique Chips and Systems
John, Eugene & Juan Rubio & Vojin G. Oklobdzija & Stephen W. Keckler & Tao Li & Chand John & Rabi N. Mahapatra & Rohit Singhal & Darren J. Kerbyson & Praveen Sunder Bhojwani & Nikos Pistianis & Ramadass Nagarajan & Rajagopalan Deikan & He
Language: English
Published by CRC Press, 2007
- Hardcover
Seller: Mahler Books, PFLUGERVILLE, TX, U.S.A.Mahler Books
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Hardcover. Condition: Very Good. This book is in very good condition; no remainder marks. Appears to have been gently used. Inside pages are clean. ; Computer Engineering Series; 6.75 X 0.97 X 9.47 inches; 386 pages.
Language: English
Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2009
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 132.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Data Integrity for On-Chip Interconnects | A Communication Theoretic Approach | Rohit Singhal | Taschenbuch | Englisch | VDM Verlag Dr. Müller | EAN 9783639203660 | Verantwortliche Person für die EU: VDM Verlag Dr. Müller, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu. …
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Singhal RohitDr. Singhal is a Senior Design Engineer, at Integrated Device Technology Inc. Dr. Choi and Dr. Mahapatra are both Associate Professors at Texas A&M University. This work resulted from Dr. Singhal s doctoral research .…
Language: English
Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2009
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. Print on Demand pp. 132 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.
Language: English
Published by VDM Verlag Dr. Mueller Aktiengesellschaft & Co. KG, 2009
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. PRINT ON DEMAND pp. 132.
- Softcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The desire for having a smaller-faster chip that does more than ever before, has led to shrinking feature size and growing integration density. This integration has left designers grappling with increasing concerns of signal-integrity (SI), timing- closure and power-consumption. Firstly, the shrinking feature size has resulted in greater delays. Further, the adjacent wires are now very close and cause Cross-talk to each other's signals. Traditional designs focus on protecting SI on long parallel wires. The SI designs accomodate the worst case delays of signals; while they aim to improve the worst-case delays at a circuit level using novel tricks, they are transparent to the actual data carried in the wires. Departing from this trend, this work aims to introduce an information theoretic approach to address data-integrity (DI). A novel approach for evaluating the data carrying capacity of long parallel wires is presented herein. This capacity is much greater than the data-rate achieved by SI designs. This work also proposes several practical designs with data-rate approaching this capacity.…
