Published by Springer
ISBN 10: 8120090004 ISBN 13: 9788120090002
Seller: Books in my Basket, New Delhi, India
Hardcover. Condition: New. ISBN: 9783211728604.
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Seller: Basi6 International, Irving, TX, U.S.A.
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Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
Language: English
Published by Wien, Society for Micro- and Nanoelectronics - TU Wien,, 2012
ISBN 10: 3901578250 ISBN 13: 9783901578250
Seller: COTTAGE Antiquariat - anbu.at, Langenzersdorf, Austria
4°, Original-Broschur. xiii, 84 Seiten. Einband berieben und mit Lagerspuren, innen tadellos. Ein offensichtlich ungelesenes, durchgehend sauberes Exemplar. In englischer Sprache. IS: 9783901578250 ****An unsere Kunden in Deutschland: Versand nach Deutschland einmal in der Woche ab Freilassing mit der Deutschen Post.*** - Sprache: Englisch Gewicht in Gramm: 550.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
US$ 69.22
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
US$ 69.22
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Add to basketCondition: New. In.
Condition: As New. Unread book in perfect condition.
US$ 68.63
Quantity: 1 available
Add to basketGood. UK stocked, available immediately. Hardcover, published by Springer in 1989. First edition. Very minor rubbing to the printed board covers, the front endpaper has been clipped. The text is unmarked throughout, a nice copy. Illustrated. Weight (unpacked) is 678 grams.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 324.
Condition: New. pp. 532.
Seller: Basi6 International, Irving, TX, U.S.A.
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Language: German
Published by Schweizerbart Sche Vlgsb., 2004
ISBN 10: 3510959132 ISBN 13: 9783510959136
Seller: medimops, Berlin, Germany
Condition: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.
Seller: UK BOOKS STORE, London, LONDO, United Kingdom
US$ 90.96
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Add to basketCondition: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Seller: Revaluation Books, Exeter, United Kingdom
US$ 91.50
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Add to basketPaperback. Condition: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Seller: Revaluation Books, Exeter, United Kingdom
US$ 95.75
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Add to basketPaperback. Condition: Brand New. 524 pages. 9.50x6.75x1.00 inches. In Stock.
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Seller: La bataille des livres, Pradinas, France
Condition: Très bon. Simulation of Semiconductor Devices and Processes: Volume 5 | Selberherr et alii | Springer-Verlag, 1993, in-8 cartonnage éditeur, 504 pages. Couverture propre. Dos solide. Intérieur frais. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Bel état ! [BT14+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
US$ 106.89
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Condition: New. 1st ed. 2021 edition NO-PA16APR2015-KAP.
Seller: Majestic Books, Hounslow, United Kingdom
US$ 119.25
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Seller: Basi6 International, Irving, TX, U.S.A.
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Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
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Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Condition: New.