Totta (27 results)

Condition: New. In.

Hardcover. Condition: Good. Dust Jacket Condition: Good. Hardbound in dust jacket. Some chipping, wear, & soiling to dust jacket, otherwise very good.

Hardcover. Condition: Very Good. 1st Edition. Signed by Paul A. Totta. Boards with superficial wear, light edge wear. Spine with some creasing toward tips. Internally clean and unmarked. Light soil to textblock edges. Due to weight of book, international orders cannot be accepted. Shelf 5c. Signed by Author(s).

Condition: Good. *Price HAS BEEN REDUCED by 10% until Tuesday, May 26 (holiday SALE item)* 302 pp., hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.

PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condition: New. Print on Demand.

PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Paperback. Condition: New. Print on Demand. Embark on a captivating journey with this memoir as the author, born into an impoverished family on the island of Santiago, navigates a male-dominated society and the challenges of colonialism. The author's groundbreaking dance performances and fearless leadership as a young woman set the stage for a life filled with both triumphs and tribulations. The narrative spans the author's childhood in a modest palhota, the impact of colonial rule on her people, and a transformative love affair that leads to her departure from her homeland. Along the way, the author grapples with issues of racial prejudice and stereotypes, ultimately emerging as a symbol of defiance and resilience. This book offers a rare glimpse into the life of a remarkable woman who overcame adversity to become a celebrated artist and advocate for social change. Its insights into the intersection of race, gender, and colonialism continue to resonate powerfully, making this memoir an essential read for anyone seeking a deeper understanding of this complex and tumultuous period in history. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item.

PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condition: New.

Taschenbuch. Condition: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Condition: Sehr gut. Zustand: Sehr gut | Seiten: 302 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Paperback. Condition: Good. 49 p. ill. ; 21 cm Leopold J. Vermeiren ; eszperanto?bo?l fordi?totta Szabadi Tibor ; a rajzokat kész. Szabadiné Mo?zes Gyo?ngyi. Hungarian.

Condition: Good. 1970. Hardback. Magyar nyelvu sz?veg. Text in Hungarian. Fine in fine dust wrapper. DW showing shelfwear and a little age. Toned, text is crisp and clear and remains a fine copy. . . . .

Paperback. Condition: New. Print on Demand. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item.

Paperback. Condition: Fair. 1st Edition. Original publication, text in Portuguese. ***Missing front cover, pages are age toned but still tight and unread as evident by pages still being unopened/uncut. Scarce, historical text. 318pp + fold-out. Book.

Paperback. Condition: Good. 1st Edition. Original publication, text in Portuguese. Chipping and mild smudging to cover, pages are age toned but still tight and unread as evident by pages still being unopened. Scarce, historical text. 318pp + fold-out map. Book.

Condition: Usado- bueno.

Paperback. Condition: new. Paperback. Whispers from the Abyss: Book One (2017-2019)Embark on a profound poetic journey with the first volume of the "Whispers from the Abyss" series, a collection of evocative poems written by Totta between 2017 and the end of 2019. This volume is thoughtfully divided into three chapters, each delving into a different aspect of contemporary life: social dynamics, environmental concerns, and technological advancements.Chapter 1: Book of SocialThe "Book of Social" chapter explores the complex tapestry of human interactions and societal norms. Each poem is timestamped with its creation date (e.g., S17:01 for January 2017, S18:02 for February 2018), offering a chronological reflection on social changes and personal experiences. These verses capture the essence of connection, identity, and the ever-evolving social landscape.Chapter 2: Book of ClimateIn the "Book of Climate" chapter, Totta addresses the urgent and compelling issues surrounding our environment. Poems beginning with a "C" and their respective dates (e.g., C17:01 for January 2017) navigate the delicate balance between humanity and nature. This chapter serves as both a call to action and a meditation on our collective responsibility to protect the Earth.Chapter 3: Book of TechThe "Book of Tech" chapter delves into the wonders and challenges of technological progress. Each poem starts with a "T" followed by the date (e.g., T19:01 for January 2019), exploring how technology influences our lives, identities, and futures. Through these verses, Totta examines the awe of innovation, digital relationships, and the ethical implications of a tech-driven society.Whispers from the Abyss: Book One invites readers to explore the profound themes of social interaction, environmental stewardship, and technological impact through Totta's masterful poetry. Each chapter offers a unique perspective, making this volume a rich and thought-provoking collection that resonates with the complexities of modern life.Immerse yourself in Book One, and let Totta's words guide you through the whispers of the abyss, revealing the hidden truths of our contemporary world. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Paperback. Condition: new. Paperback. The Prompt WarsWho sent the first prompt? No one remembers. But by the time the meeting invite hit every screen, it was already too late.At Kestrel Systems, productivity is up, errors are down, and management couldn't be happier - even if no one knows who's actually doing the work. Secret AI agents whisper in the shadows, custom GPTs smuggled on flash drives guide billion-dollar decisions, and employees are blurring the line between human and helper.In this razor-sharp, satirical near-future thriller, the corporate world collides with runaway AI innovation. As digital assistants become digital accomplices, one anonymous meeting threatens to expose everything - or launch a new kind of war.The Prompt Wars is Silicon Valley meets 1984 - a fast-paced, thought-provoking story for fans of tech thrillers, speculative fiction, and anyone wondering what happens when we stop writing prompts. and the prompts start writing us. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

Leather Bound. Condition: New. Language: Portuguese. Language: Portuguese. Presenting an Exquisite Leather-Bound Edition, expertly crafted with Original Natural Leather that gracefully adorns the spine and corners. The allure continues with Golden Leaf Printing that adds a touch of elegance, while Hand Embossing on the rounded spine lends an artistic flair. This masterpiece has been meticulously reprinted in 2024, utilizing the invaluable guidance of the original edition published many years ago in 1912. The contents of this book are presented in classic black and white. Its durability is ensured through a meticulous sewing binding technique, enhancing its longevity. Imprinted on top-tier quality paper. A team of professionals has expertly processed each page, delicately preserving its content without alteration. Due to the vintage nature of these books, every page has been manually restored for legibility. However, in certain instances, occasional blurriness, missing segments, or faint black spots might persist. We sincerely hope for your understanding of the challenges we faced with these books. Recognizing their significance for readers seeking insight into our historical treasure, we've diligently restored and reissued them. Our intention is to offer this valuable resource once again. We eagerly await your feedback, hoping that you'll find it appealing and will generously share your thoughts and recommendations. Lang: - Portuguese, Pages: - 342, Print on Demand. If it is a multi-volume set, then it is only a single volume. We are specialised in Customisation of books, if you wish to opt different color leather binding, you may contact us. This service is chargeable. Product Disclaimer: Kindly be informed that, owing to the inherent nature of leather as a natural material, minor discolorations or textural variations may be perceptible. Explore the FOLIO EDITION (12x19 Inches): Available Upon Request. 342 342.

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch.