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Wang Ran Chakrabarty Krishnendu (20 results)
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Testing of Interposer-Based 2.5D Integrated Circuits.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
US$ 16.88
Convert currencyUS$ 35.12 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketXIV, 182 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Condition: New.
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US$ 116.44
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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US$ 126.40
Convert currencyUS$ 3.99 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: As New. Unread book in perfect condition.
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Testing of Interposer-Based 2.5D Integrated Circuits
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 129.97
Convert currencyUS$ 16.06 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Condition: New. pp. 182.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: New.
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Testing of Interposer-Based 2.5D Integrated Circuits
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 149.16
Convert currencyUS$ 16.06 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 178.18
Convert currencyUS$ 33.52 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketHardcover. Condition: Brand New. 182 pages. 9.25x6.25x0.50 inches. In Stock.
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US$ 151.01
Convert currencyUS$ 8.71 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. Print on Demand.
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Testing of Interposer-Based 2.5D Integrated Circuits
Published by Springer International Publishing, 2017
ISBN 10: 3319547135 ISBN 13: 9783319547138
Language: English
US$ 108.50
Convert currencyUS$ 57.35 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a single-source guide to the practical challenges in testing of 2.5D ICsPresents an efficient method to locate defects in a passive interposer before stackingDescribes an efficient interconnect-test solution to target through-silicon vias (.
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US$ 161.54
Convert currencyUS$ 8.71 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. Print on Demand pp. 182.
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US$ 164.18
Convert currencyUS$ 11.65 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. PRINT ON DEMAND.
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Testing of Interposer-Based 2.5D Integrated Circuits
Published by Springer International Publishing, 2018
ISBN 10: 3319854615 ISBN 13: 9783319854618
Language: English
US$ 118.81
Convert currencyUS$ 57.35 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a single-source guide to the practical challenges in testing of 2.5D ICsPresents an efficient method to locate defects in a passive interposer before stackingDescribes an efficient interconnect-test solution to target through-silicon vias (.
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US$ 175.50
Convert currencyUS$ 11.65 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. PRINT ON DEMAND pp. 182.
