Youngsoo Kim (44 results)
Lean Linear City: Arterial Arcology
Soleri, Paolo, Youngsoo Kim (editor), Charles Anderson, Adam Nordfors, Scott Riley, Tomiaki Tamura; Jeff Stein (fwd.), Lissa McCullough (text editor)
- Softcover
- First Edition
Seller: Saucony Book Shop, Kutztown, PA, U.S.A.Saucony Book Shop
Contact seller5-star sellerCondition: Used - Good
US$ 25.00
US$ 6.00 shippingShips within U.S.A.Quantity: 1 available
Soft cover. Condition: Good. 1st Edition. Stiff white and red wraps, lettered in black. Worn but intact, with rubbed edges and corners, bottom back cover corner creases. Binding square with stress crease, reinforced with clear tape. 1st ptg. A decent reading/study copy. Size: 12mo - over 6¾" - 7¾" tall. Youngsoo Kim; Adam Nordfo…rs; Charles Anderson; Tomiaki Tamura (illustrator). Book.
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Lean Linear City: Arterial Arcology
Paolo Soleri; Scott Riley; Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tamura; Jeff Stein (introduction)
- Softcover
Seller: Vive Liber Books, Somers, CT, U.S.A.Vive Liber Books
Contact seller5-star sellerCondition: Used - Good
US$ 32.08
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: good. Pages are clean with normal wear. May have limited markings & or highlighting within pages & or cover. May have some wear & creases on the cover. The spine may also have minor wear. May not include CD DVD, access code or any other supplemental materials. Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tam…ura (illustrator).
Lean Linear City: Arterial Arcology
Paolo Soleri; Scott Riley; Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tamura; Jeff Stein (introduction)
- Softcover
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
Contact seller5-star sellerCondition: Used - Good
US$ 32.92
Free ShippingShips within U.S.A.Quantity: 1 available
Unknown. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tamura (illustrator).
Lean Linear City: Arterial Arcology
Paolo Soleri; Scott Riley; Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tamura; Jeff Stein (introduction)
- Softcover
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.ThriftBooks-Atlanta
Contact seller5-star sellerCondition: Used - Fair
US$ 32.92
Free ShippingShips within U.S.A.Quantity: 1 available
Unknown. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less. Youngsoo Kim; Adam Nordfors; Charles Anderson; Tomiaki Tamura (illustrator).
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- Softcover
Seller: Scissortail, Oklahoma City, OK, U.S.A.Scissortail
Contact seller5-star sellerCondition: Used - Very good
US$ 67.92
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: very_good. This is a well-cared-for used book with light signs of previous use. There may be minor cover wear, a faint crease, or slight spine wear, but overall it's in great shape and fully readable. Please note: -May contain library or rental stickers. -Supplemental materials e.g., CDs, access codes, inserts are not… guaranteed. -Box sets may not include original exterior box. Your satisfaction is our top priority! If you have any questions or concerns about your order, please don't hesitate to reach out. Thank you for shopping with us and supporting small businessâ"happy reading.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
US$ 75.00
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
Contact seller5-star sellerCondition: New
US$ 79.69
Free ShippingShips within U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
US$ 77.06
US$ 6.77 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 87.57
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 236.
Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 88.13
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 223.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
US$ 86.25
US$ 16.16 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Language: English
Published by Cognella Academic Publishing 2016-01-30, 2016
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
US$ 82.24
US$ 20.90 shippingShips from United Kingdom to U.S.A.Quantity: 10 available
Paperback. Condition: New.
VLSI-SoC: Design for Reliability, Security, and Low Power: 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers (IFIP Advances in Information and Communication Technology)
Shin, Youngsoo (Editor) / Tsui, Chi Ying (Editor) / Kim, Jae-Joon (Editor) / Choi, Kiyoung (Editor) / Reis, Ricardo (Editor)
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 98.66
US$ 13.49 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.
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Language: English
Published by Springer International Publishing, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 63.59
US$ 72.32 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the boo…k were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
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Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
US$ 59.92
US$ 80.80 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. VLSI-SoC: Design for Reliability, Security, and Low Power | 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers | Youngsoo Shin (u. a.) | Taschenbuch | IFIP Advances in Information and Communication… Technology | xiii | Englisch | 2018 | Springer | EAN 9783319834405 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
US$ 69.42
US$ 71.41 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in…the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.
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- Softcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
US$ 99.11
US$ 56.55 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. KlappentextrnrnProvides a concise, accessible introduction to trigonometry for high school and first-year college and university students. The book builds up the skill sets needed to succeed in college and university calculus courses. The materi.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 141.20
US$ 16.86 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 136 pages. 11.02x8.50x0.29 inches. In Stock.
Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
US$ 125.06
US$ 33.73 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
US$ 137.57
US$ 33.73 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Lean Linear City: Arterial Arcology - Soleri SIGNED
SOLERI, Paolo; Youngsoo Kim; Charles Anderson; Adam Nordfors; Scott Riley; Tomiaki Tamura
Published by Cosanti Press, Mayer AZ, 2012
- Softcover
- First Edition
- Signed
Seller: Long Brothers Fine & Rare Books, ABAA, Seattle, WA, U.S.A.Long Brothers Fine & Rare Books, ABAA
Contact seller3-star sellerCondition: Used - Very good
US$ 125.00
US$ 3.50 shippingShips within U.S.A.Quantity: 1 available
Add to basketStiff illustrated wraps. Condition: Very Good. First Edition. 8vo. Pp. 195. Illustrated with photos, plans and diagrams. Foreword by Jeff Stein. With references, credits and index. Perfect bound with stiff illustrated paper wraps. First leaf signed by Soleri with red felt pen. Covers minimally rubbed and soiled. A collaborative…investigation of Soleri's arterial arcology ideas for emerging relationships of people, place and planet.
Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 54.96
US$ 7.85 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
- Print on Demand
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 68.36
Free ShippingShips within U.S.A.Quantity: 10 available
Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
US$ 68.36
Free ShippingShips within U.S.A.Quantity: 10 available
Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
US$ 54.96
US$ 27.94 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 72.68
US$ 8.77 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
- Hardcover
- Print on Demand
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
US$ 78.69
US$ 3.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
US$ 76.38
US$ 11.49 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND.
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Language: English
Published by Springer International Publishing Apr 2018, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 63.59
US$ 26.55 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 pap…ers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 240 pp. Englisch.
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Language: English
Published by Springer International Publishing Sep 2016, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
US$ 63.59
US$ 26.55 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers inc…luded in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 240 pp. Englisch.
