9781574446746 - Handbook of Semiconductor Interconnection Technology by Shwartz, Geraldine Cogin (17 results)
Handbook of Semiconductor Interconnection Technology, 2nd Edition (Original Price £ 153.00)
Geraldine Cogin Shwartz, Geraldine C. Schwartz, Kris V. Srikrishnan
- Softcover
- International Edition
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerInternational EditionCondition: New
US$ 93.25
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Condition: Brand New. New.SoftCover International edition. Different ISBN and Cover image but contents are same as US edition.Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Handbook of Semiconductor Interconnection Technology
Shwartz, Geraldine Cogin; Schwartz, Geraldine C. [Editor]; Srikrishnan, Kris V. [Editor];
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
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US$ 216.51
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Hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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US$ 337.36
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HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 342.67
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Condition: New.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 337.35
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Condition: New.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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US$ 358.04
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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US$ 366.60
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
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US$ 409.17
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Hardcover. Condition: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim an…d many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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US$ 407.66
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Condition: New. pp. 536 2nd Edition.
- Hardcover
Seller: moluna, Greven, Germanymoluna
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US$ 375.13
US$ 56.97 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: New. Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. SrikrishnanFirst introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 427.74
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Hardcover. Condition: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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US$ 464.20
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Condition: New. pp. 536.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
US$ 483.55
US$ 11.05 shippingShips from Ireland to U.S.A.Quantity: 10 available
Condition: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwar…tz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . .
Handbook of Semiconductor Interconnection Technology, Second Edition
Schwartz, Geraldine C. (Edited by)/ Srikrishnan, Kris V. (Edited by)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
US$ 530.02
US$ 20.29 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Brand New. 2nd edition. 520 pages. 10.00x6.75x1.00 inches. In Stock.
Handbook of Semiconductor Interconnection Technology
Schwartz, Geraldine Cogin; Srikrishnan, Kris V.; Bross, Arthur. Ed(s): Schwartz, Geraldine Cogin; Srikrishnan, Kris V.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
US$ 560.02
US$ 10.50 shippingShips within U.S.A.Quantity: 10 available
Condition: New. Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Editor(s): Schwar…tz, Geraldine Cogin; Srikrishnan, Kris V. Num Pages: 536 pages, 227 black & white illustrations, 12 black & white tables, 1 black & white halftones. BIC Classification: TJFC. Category: (P) Professional & Vocational. Dimension: 254 x 178 x 30. Weight in Grams: 1133. . 2006. 2 Rev ed. Hardback. . . . . Books ship from the US and Ireland.
- Hardcover
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contact seller5-star sellerCondition: New
US$ 667.30
US$ 37.00 shippingShips from Australia to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim an…d many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.What's in this Edition: Detailed discussion of electrochemical equipment for plating copper Information on tools used for evaporation, chemical vapor deposition, and plasma processes Emphasis on measurement of mechanical and thermal properties of insulators Methods for characterizing porous dielectric thin films Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides Process schemes based on the increased need for borderless contact gates and source/drain Expanded discussion on choices for low-dielectric insulators Concentration on electroplated copper, especially morphology of plated films and their properties Developments in thin film liners and barriers Expanded material on copper reliability Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
US$ 379.92
US$ 8.79 shippingShips from United Kingdom to U.S.A.Quantity: 3 available
Condition: New. pp. 536 Illus. This item is printed on demand.
