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Advanced Wirebond Interconnection Technology by Prasad Shankara (9 results)
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if youâre not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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Advanced Wirebond Interconnection Technology
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 349.70
Convert currencyUS$ 16.01 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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US$ 379.01
Convert currencyUS$ 2.64 shipping within U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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US$ 402.30
Convert currencyUS$ 56.81 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. From the reviews: This book is intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers. Operational issues such as specifying and optimizing wire and autom.
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Advanced Wirebond Interconnection Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 447.69
Convert currencyUS$ 20.04 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Advanced Wirebond Interconnection Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
US$ 455.47
Convert currencyUS$ 20.04 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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US$ 444.47
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Add to basketHardcover. Condition: Like New. Like New. book.
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US$ 475.22
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Add to basketCondition: As New. Unread book in perfect condition.
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Advanced Wirebond Interconnection Technology
Published by Springer Us Apr 2004, 2004
ISBN 10: 1402077629 ISBN 13: 9781402077623
Language: English
US$ 566.91
Convert currencyUS$ 39.37 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. Neuware - Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.
