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Basics Scale Modeling (16 results)
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Softcover. Condition: Fair. Kalmbach Books Fine Scale Modeler Books - Military Vehicles & Tanks (Kalmbach Books) Basics of Ship Modeling - The Illustrated Guide (Fair+)Manufacturer: Kalmbach BooksProduct Line: Fine Scale Modeler Books - Military Vehicles & Tanks (Kalmbach Books)Type: SoftcoverCode: KAL12220Copyright Date: 2000Author: Mike AshleyPage Count: 112Please review the condition and any condition notes for the exact condition of this item. All pictures are stock photos. The condition of the item you will receive is Fair+. Our grading system is explained in the terms of sale section of our bookseller page. Please feel free to contact us with any questions. Product Description:Launch better ship models than ever before with expert Mike Ashelyâs advice, including how to remove seams, improve hull and deck assemblies, and even how to paint and weather your ships.
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The Basics of Scale Modeling
Seller: Mom's Resale and Books, River Hills, WI, U.S.A.
Seller rating 5 out of 5 stars
Softcover. Condition: Very Good. 2005 Softcover Edition. Light handling wear to cover. Pages unmarked.
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Paperback. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
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Paperback. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
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The Basics of Scale Modeling
Seller: Books From California, Simi Valley, CA, U.S.A.
Seller rating 4 out of 5 stars
paperback. Condition: Very Good.
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Basics of Scale Automotive Modeling - Getting Started in the Hobby
Language: English
Published by Kalmbach Books, Iola, WI
Seller: J. F. Whyland Books, Jeffersonville, IN, U.S.A.
Seller rating 4 out of 5 stars
First Edition
Wraps. Condition: Fine. No Jacket. First Edition. Fully illustrated. Fine in illustrated wraps as issued. BX46.
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Paperback. Condition: new. New Copy. Customer Service Guaranteed.
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Process Modeling of Chemical Mechanical Planarization: An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 65.00
US$ 16.15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New. Satisfaction Guaranteed or your money back.
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Paperback. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New. Satisfaction Guaranteed or your money back.
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Process Modeling of Chemical Mechanical Planarization : An Integrated Model from Abrasive Scale to Chip Scale; Basics, Characterizations, Modeling and Verification
Language: English
Published by VDM Verlag Dr. Müller, VDM Verlag Dr. Müller E.K., 2008
ISBN 10: 3639001664 ISBN 13: 9783639001662
Taschenbuch. Condition: Neu. Neuware - Chemical Mechanical Planarization (CMP) is one of the key enabling technologies for modern IC fabrication. However, mainly due to the high complexities coming from various interactions among mechanical reactions and chemical reactions, its fundamental working mechanism is still not fully understood. This book summarizes key CMP applications and challenges in modern IC fabrication, and provides a comprehensive physical CMP process model that can be applied for process characterization, process optimization, consumable development, and layout design for manufacturing (DFM). The model has been built from an abrasive scale to a chip scale, focusing on practical application for DFM while also considering CMP process conditions as key input parameters. Also included are examples of a computer model application for pattern dependent variation in shallow trench isolation CMP and the model verification with specially designed test chip. The model should help CMP professionals, DFM engineers and students of IC fabrication obtain a fundamental understanding of CMP process and characterize and improve a process through real application.
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Condition: New.
