Chip Packaging Technology Application (1 results)

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  • Language: Chinese

    Published by 电子工业出版社, 2013

    7121206498 / 9787121206498

    • Softcover

    Seller: liu xing, Nanjing, JS, Chinaliu xing

    5-star seller
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    Condition: New

    US$ 65.25

    US$ 18.00 shipping 
    Ships from China to U.S.A.

    Quantity: 1 available

    paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-07-01 Pages: 252 Language: Chinese Publisher: Electronic Industry Press IC chip packaging technology ( 2nd Edition ) Applied Talents universities planning materials is a general-purpose integrated circuits chip packaging technology materials. The book has 13 chapters. including integrated circuit chip package overview. packaging process. thick film technology . welding materials. printed circuit boards. components and circuit board bonding . sealing plastic materials.Four Satisfaction guaranteed,or money back.…