Published by Wit Press/Computational Mechanics, 2021
ISBN 10: 1784664251 ISBN 13: 9781784664251
Language: English
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Add to basketGebunden. Condition: New. Formed of papers presented at the 20th International Conference on Computational Methods and Experimental Measurements, this volume provides a view of the latest work on the interaction between computational methods and experiments.Klappentext.
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Add to basketBuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Formed of papers presented at the 20th International Conference on Computational Methods and Experimental Measurements, this volume provides a view of the latest work on the interaction between computational methods and experiments.The continuous improvement in computer efficiency, coupled with diminishing costs and the rapid development of numerical procedures have generated an ever-increasing expansion of computational simulations that permeate all fields of science and technology. As these procedures continue to grow in magnitude and complexity, it is essential to validate their results to be certain of their reliability. This can be achieved by performing dedicated and accurate experiments, which have undergone constant and enormous development. At the same time, current experimental techniques have become more complex and sophisticated so that they require the intensive use of computers, both for running experiments as well as acquiring and processing the resulting data.Some of the subject areas covered are: Fluid flow studies and experiments; Structural and stress analysis; Materials characterization; Electromagnetic problems; Structural integrity; Destructive and non-destructive testing; Heat transfer and thermal processes; Advances in computational methods; Automotive applications; Aerospace applications; Ocean engineering and marine structures; Fluid structure interaction; Bio-electromagnetics; Process simulations; Environmental monitoring, modelling and applications; Validation of computer modelling; Data and signal processing; Virtual testing and verification; Electromagnetic compatibility; Life cycle assessment.