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Designing Network on Chip Architectures by Tatas Konstantinos (29 results)
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![Stock image for Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource]. for sale by Universitätsbuchhandlung Herta Hold GmbH](https://pictures.abebooks.com/isbn/9781461442745-us-300.jpg)
Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource].
Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
US$ 16.81
Convert currencyUS$ 34.97 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer-Verlag Publishing, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Condition: Like New. Fine/As New; Semi-Flexible Covers; This book is brand new and still sealed in the publisher's original shrinkwrap; Perfect, new condition; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Red and purple covers with title in white lettering; 2013, Springer-Verlag Publishing; 265 pages; "Designing 2D and 3D Network-on-Chip Architectures," by Konstantinos Tatas, et al.
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US$ 116.44
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US$ 126.78
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Designing 2D and 3D Network-on-Chip Architectures
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 120.62
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US$ 116.55
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Add to basketPaperback. Condition: New.
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Designing 2D and 3D Network-on-Chip Architectures
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
US$ 130.16
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Add to basketCondition: New. In.
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Designing 2D and 3D Network-on-Chip Architectures (Hardcover)
Published by Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Hardcover. Condition: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Designing 2D and 3D Network-on-Chip Architectures (Paperback)
Published by Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Paperback. Condition: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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US$ 108.06
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US$ 120.54
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US$ 178.24
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Add to basketHardcover. Condition: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer New York, Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
US$ 128.47
Convert currencyUS$ 69.95 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
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US$ 192.11
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Add to basketPaperback. Condition: Brand New. reprint edition. 278 pages. 9.25x6.10x0.66 inches. In Stock.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer New York, Springer New York, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
US$ 133.93
Convert currencyUS$ 73.38 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer New York, Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
US$ 144.08
Convert currencyUS$ 69.95 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
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Condition: New. pp. 278.
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US$ 147.47
Convert currencyUS$ 72.45 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
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US$ 189.45
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Add to basketHardcover. Condition: Like New. Like New. book.
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US$ 226.79
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Add to basketPaperback. Condition: Like New. Like New. book.
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Designing 2D and 3D Network-on-Chip Architectures (Paperback)
Published by Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
US$ 339.46
Convert currencyUS$ 37.00 shipping from Australia to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Designing 2D and 3D Network-on-Chip Architectures (Hardcover)
Published by Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
US$ 359.95
Convert currencyUS$ 37.00 shipping from Australia to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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US$ 103.56
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Add to basketCondition: new. Questo è un articolo print on demand.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 128.47
Convert currencyUS$ 26.81 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer-Verlag New York Inc., 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 138.74
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Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 433.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
US$ 144.08
Convert currencyUS$ 26.81 shipping from Germany to U.S.A.Quantity: 2 available
Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
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Designing 2D and 3D Network-on-Chip Architectures
Published by Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
US$ 158.57
Convert currencyUS$ 22.15 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 575.
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US$ 216.19
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Add to basketCondition: New. Print on Demand pp. 278.
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US$ 241.82
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Add to basketCondition: New. PRINT ON DEMAND pp. 278.
