Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
XI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
Published by Springer-Verlag Publishing, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: Salish Sea Books, Bellingham, WA, U.S.A.
Condition: Like New. Fine/As New; Semi-Flexible Covers; This book is brand new and still sealed in the publisher's original shrinkwrap; Perfect, new condition; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Red and purple covers with title in white lettering; 2013, Springer-Verlag Publishing; 265 pages; "Designing 2D and 3D Network-on-Chip Architectures," by Konstantinos Tatas, et al.
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Condition: New. pp. 278 Softcover reprint of the original 1st ed. 2014 edition NO-PA16APR2015-KAP.
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Add to basketHardcover. Condition: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
Published by Springer New York, Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
US$ 191.55
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Add to basketPaperback. Condition: Brand New. reprint edition. 278 pages. 9.25x6.10x0.66 inches. In Stock.
Published by Springer New York, Springer New York, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Published by Springer New York, Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Taschenbuch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
Seller: Mispah books, Redhill, SURRE, United Kingdom
US$ 188.05
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Add to basketHardcover. Condition: Like New. Like New. book.
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Seller: Mispah books, Redhill, SURRE, United Kingdom
US$ 225.11
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Add to basketPaperback. Condition: Like New. Like New. book.
Condition: new. Questo è un articolo print on demand.
Published by Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
Published by Springer-Verlag New York Inc., 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
US$ 137.71
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Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 433.
Published by Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
Published by Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
US$ 157.40
Quantity: Over 20 available
Add to basketHardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 575.
Seller: Majestic Books, Hounslow, United Kingdom
US$ 173.06
Quantity: 4 available
Add to basketCondition: New. Print on Demand pp. 278.
Seller: preigu, Osnabrück, Germany
Buch. Condition: Neu. Designing 2D and 3D Network-on-Chip Architectures | Konstantinos Tatas (u. a.) | Buch | xiii | Englisch | 2013 | Springer US | EAN 9781461442738 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 278.