Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
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Add to basketXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
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Published by Springer-Verlag Publishing, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: Salish Sea Books, Bellingham, WA, U.S.A.
Condition: Like New. Fine/As New; Semi-Flexible Covers; This book is brand new and still sealed in the publisher's original shrinkwrap; Perfect, new condition; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Red and purple covers with title in white lettering; 2013, Springer-Verlag Publishing; 265 pages; "Designing 2D and 3D Network-on-Chip Architectures," by Konstantinos Tatas, et al.
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Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Add to basketPaperback. Condition: New.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Published by Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: Grand Eagle Retail, Mason, OH, U.S.A.
Hardcover. Condition: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Published by Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: Grand Eagle Retail, Mason, OH, U.S.A.
Paperback. Condition: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Published by Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
US$ 176.78
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Add to basketCondition: New. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Num Pages: 278 pages, 65 black & white illustrations, 79 colour illustrations, 12 black & white tables, biograp. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 241 x 167 x 21. Weight in Grams: 556. . 2013. 2014th Edition. Hardcover. . . . .
Published by Springer New York, Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
US$ 129.21
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Add to basketBuch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
Published by Springer New York, Springer New York, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
US$ 134.70
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
US$ 177.53
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Add to basketHardcover. Condition: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
Published by Springer New York, Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
US$ 144.91
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Add to basketTaschenbuch. Condition: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
US$ 148.32
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Condition: New. pp. 278.
Published by Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Num Pages: 278 pages, 65 black & white illustrations, 79 colour illustrations, 12 black & white tables, biograp. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 241 x 167 x 21. Weight in Grams: 556. . 2013. 2014th Edition. Hardcover. . . . . Books ship from the US and Ireland.
US$ 191.37
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Add to basketPaperback. Condition: Brand New. reprint edition. 278 pages. 9.25x6.10x0.66 inches. In Stock.
Published by Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: AussieBookSeller, Truganina, VIC, Australia
US$ 344.51
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Add to basketPaperback. Condition: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Published by Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Language: English
Seller: AussieBookSeller, Truganina, VIC, Australia
US$ 365.31
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Add to basketHardcover. Condition: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Seller: Brook Bookstore On Demand, Napoli, NA, Italy
US$ 104.15
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Add to basketCondition: new. Questo è un articolo print on demand.
Published by Springer-Verlag New York Inc., 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
US$ 138.95
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Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 433.