Distributed Embedded Systems Design (227 results)

Condition: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condition: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less.

gebundene Ausgabe. Condition: Gut. Auflage: 2nd ed. 376 Seiten; Der Erhaltungszustand des hier angebotenen Werks ist trotz seiner Bibliotheksnutzung sehr sauber. Es befindet sich neben dem Rückenschild lediglich ein Bibliotheksstempel im Buch; ordnungsgemäß entwidmet. Sprache: Englisch Gewicht in Gramm: 740.…

Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

gebundene Ausgabe. Condition: Gut. 2. Auflage.. 338 Seiten; Der Erhaltungszustand des hier angebotenen Werks ist trotz seiner Bibliotheksnutzung sehr sauber und kann entsprechende Merkmale aufweisen (Rückenschild, Instituts-Stempel.). In ENGLISCHER Sprache. Sprache: Englisch Gewicht in Gramm: 660.

XXIII, 300 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Gestempelt. Sprache: Englisch.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Hard Cover. Condition: Good. No Jacket. First Edition. From an academic library with the usual stamps and labels. Apart from the library evidence contents are clean. Some general wear to the black boards moreso to the corners. A00019646.

Condition: New.

Condition: New.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. pp. 290.

hardcover. Condition: Very Good. Cover and edges may have some wear.

This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. No dust jacket. Good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9781441982360.

Hardcover. Condition: New. Brand new book, sourced directly from publisher. Dispatch time is 24-48 hours from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Condition: New. pp. 290 Illus.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: New. pp. 290.

paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

hardcover. Condition: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.

Gebundene Ausgabe. Condition: Sehr gut. Gebraucht - Sehr gut - ungelesen, mit leichten Mängeln an Schnitt oder Umschlag durch Lager- oder Transportschaden, Mängelexemplar -This year, the IFIP Working Conference on Distributed and Parallel Embedded Sys tems (DIPES 2008) is held as part of the IFIP World Computer Congress, held in Milan on September 7 10, 2008. The embedded systems world has a great deal of experience with parallel and distributed computing. Many embedded computing systems require the high performance that can be delivered by parallel computing. Parallel and distributed computing are often the only ways to deliver adequate real time performance at low power levels. This year's conference attracted 30 submissions, of which 21 were accepted. Prof. Jor ¿ g Henkel of the University of Karlsruhe graciously contributed a keynote address on embedded computing and reliability. We would like to thank all of the program committee members for their diligence. Wayne Wolf, Bernd Kleinjohann, and Lisa Kleinjohann Acknowledgements We would like to thank all people involved in the organization of the IFIP World Computer Congress 2008, especially the IPC Co Chairs Judith Bishop and Ivo De Lotto, the Organization Chair Giulio Occhini, as well as the Publications Chair John Impagliazzo. Further thanks go to the authors for their valuable contributions to DIPES 2008. Last but not least we would like to acknowledge the considerable amount of work and enthusiasm spent by our colleague Claudius Stern in preparing theproceedingsofDIPES2008. Hemadeitpossibletoproducethemintheircurrent professional and homogeneous style.Libri GmbH, Europaallee 1, 36244 Bad Hersfeld 226 pp. Englisch.…

Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.

Condition: New. In English.