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Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: Grand Eagle Retail, Mason, OH, U.S.A.
Hardcover. Condition: new. Hardcover. This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the authors extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Based on the authors extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Published by Springer International Publishing, Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
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Add to basketTaschenbuch. Condition: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Published by Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
US$ 115.66
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Seller: Books Puddle, New York, NY, U.S.A.
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Seller: Revaluation Books, Exeter, United Kingdom
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Add to basketPaperback. Condition: Brand New. reprint edition. 188 pages. 9.25x6.10x0.43 inches. In Stock.
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Add to basketPaperback. Condition: New. New. book.
Published by Springer International Publishing, Springer International Publishing Mär 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
US$ 167.07
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Add to basketBuch. Condition: Neu. Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author¿s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 188 pp. Englisch.
Published by Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: AHA-BUCH GmbH, Einbeck, Germany
US$ 167.07
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.
Seller: Revaluation Books, Exeter, United Kingdom
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Add to basketHardcover. Condition: Brand New. 187 pages. 9.25x6.10x0.71 inches. In Stock.
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: AussieBookSeller, Truganina, VIC, Australia
US$ 371.29
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Add to basketHardcover. Condition: new. Hardcover. This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the authors extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Based on the authors extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Published by Springer International Publishing Dez 2018, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
US$ 115.66
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Add to basketTaschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Published by Springer International Publishing, 2018
ISBN 10: 3030093239 ISBN 13: 9783030093235
Language: English
Seller: moluna, Greven, Germany
US$ 97.82
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Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Published by Springer International Publishing Mrz 2018, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
US$ 167.07
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Add to basketBuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. 188 pp. Englisch.
Published by Springer International Publishing, 2018
ISBN 10: 3319757679 ISBN 13: 9783319757674
Language: English
Seller: moluna, Greven, Germany
US$ 138.92
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Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) productsProvides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms.
Seller: Majestic Books, Hounslow, United Kingdom
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Seller: Biblios, Frankfurt am main, HESSE, Germany
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