Seller: PBShop.store US, Wood Dale, IL, U.S.A.
PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 25.63
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 25.67
Convert currencyQuantity: Over 20 available
Add to basket
Published by U. S. Government Printing Office, Washington, DC, 1994
ISBN 10: 0160463076 ISBN 13: 9780160463075
Language: English
Seller: Ground Zero Books, Ltd., Silver Spring, MD, U.S.A.
First Edition
Wraps. Condition: very good. 24 cm, iii, [1], 280, [4] pages. Wraps. Occasional footnotes. Tables. The High Performance Computing Act of 1991 (HPCA) is an Act of Congress promulgated in the 102nd United States Congress as (Pub. L. 102-194) on December 9, 1991. Often referred to as the Gore Bill,[1] it was created and introduced by then Senator Al Gore, and led to the development of the National Information Infrastructure and the funding of the National Research and Education Network (NREN). The act built on prior US efforts of developing a national networking infrastructure, starting with the ARPANET in the 1960s, which laid the foundation for the modern Internet, and the funding of the National Science Foundation Network (NSFnet) in the 1980s. The renewed effort became known in popular language as building the Information superhighway. This hearing was part of the Subcommittee on Science's oversight of the high performance computing and communications program. This multiagency R&D initiative was authorized by the High Performance Computing Act of 1991. In this hearing the subcommittee reviewed the fiscal year 1995 budget request for the program and examined the rationale for the funding priorities that were assigned in the budget request. Presumed First Edition, First printing thus.
Published by The White House, Washington, D.C., 1996
Seller: Ground Zero Books, Ltd., Silver Spring, MD, U.S.A.
Wraps. i, 57 p. Includes illustrations. Illustrations in color. Title from cover. Very good. No dust jacket as issued.
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 33.36
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 33.56
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 33.60
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 33.65
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 33.82
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.02
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.02
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.12
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.27
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.66
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.67
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.70
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 34.79
Convert currencyQuantity: Over 20 available
Add to basket
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.
Seller: Revaluation Books, Exeter, United Kingdom
US$ 91.00
Convert currencyQuantity: 2 available
Add to basketPaperback. Condition: Brand New. reprint edition. 288 pages. 9.30x6.50x0.70 inches. In Stock.
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.
Seller: Revaluation Books, Exeter, United Kingdom
US$ 104.33
Convert currencyQuantity: 1 available
Add to basketPaperback. Condition: Brand New. 444 pages. 9.50x6.50x1.00 inches. In Stock.
Published by Mechanical Industry Press, 2024
ISBN 10: 7111755804 ISBN 13: 9787111755807
Language: English
Seller: liu xing, Nanjing, JS, China
US$ 159.33
Convert currencyQuantity: 3 available
Add to basketpaperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. XXI, 309 50 illus., 37 illus. in color. 1 Edition NO-PA16APR2015-KAP.
Seller: Gyan Books Pvt. Ltd., Delhi, India
US$ 44.04
Convert currencyQuantity: Over 20 available
Add to basket
Published by Engineering Science Reference, 2021
ISBN 10: 1668442833 ISBN 13: 9781668442838
Language: English
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New.
More buying choices from other sellers on AbeBooks
New offers from US$ 217.54
Used offers from US$ 299.18
Also find Hardcover
Published by Engineering Science Reference, 2019
ISBN 10: 1522592571 ISBN 13: 9781522592570
Language: English
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.
Published by Engineering Science Reference, 2022
ISBN 10: 1799891836 ISBN 13: 9781799891833
Language: English
Seller: Best Price, Torrance, CA, U.S.A.
Condition: New. SUPER FAST SHIPPING.